Variable spring rate thermal management apparatus attachment mechanism

1. A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate, the device comprising:

at least a first portion adapted to couple to the thermal management apparatus;

at least a second portion adapted to couple to the thermal management apparatus, the first portion and the second portion symmetrically arranged relative to each other;

wherein the first portion and the second portion are adapted to thermally couple the thermal management apparatus with the heat generating component with a first spring bias; and

wherein the first portion and the second portion are adapted to maintain the thermal management apparatus thermally coupled with the heat generating component with a second and pivot based spring bias provided in response to deflection of the device, each of the first portion and the second portion including a protruding member at a protruding member distance from a corresponding end of the first portion and a second portion, wherein contact between the protruding members and the circuit substrate provides the second spring bias.

2. The device of claim 1 , wherein the first spring bias includes a constant spring rate.

3. The device of claim 1 , wherein the second spring bias includes a variable spring rate.

4. The device of claim 1 , wherein the protruding member distance relative to a length of the corresponding first portion or the second portion defines the second spring bias.

5. The device of claim 4 , wherein the protruding member distance is adjustable to vary the second spring bias.

6. A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate, the device comprising:

a plurality of symmetrically arranged arms, an outer end of each arm adapted to couple to the thermal management device, wherein each arm provides a first spring bias on the thermal management apparatus to thermally couple the thermal management apparatus with the heat generating component; and

a plurality of protruding members, each protruding member coupled to a corresponding one of the arms at a protruding member distance from the outer end of the corresponding arm, wherein pressing the protruding members on the circuit substrate provides a second spring bias on the thermal management apparatus to thermally couple the thermal management apparatus with the heat generating component.

7. The device of claim 6 , wherein the first spring bias includes a constant spring rate.

8. The device of claim 6 , wherein the second spring bias includes a variable spring rate.

9. The device of claim 6 , wherein the protruding member distance relative to a length of the arms defines the second spring bias.

10. The device of claim 9 , wherein the protruding member distance is adjustable to vary the second spring bias.

11. The device of claim 6 , further comprising a center portion defined by the coupling of inner ends of the plurality of arms, the center portion having a locator pin configured to engage with a corresponding aperture in the circuit substrate.

12. A circuit assembly comprising:

a circuit substrate having at least one heat generating component;

at least one thermal management apparatus;

a device to couple the thermal management apparatus to the heat generating component, the device comprising at least a first portion and at least a second portion coupled to the thermal management device, wherein the first portion and the second portion provide a first spring bias on the thermal management apparatus to thermally couple the thermal management apparatus with the heat generating component; and

at least a first protruding member and at least a second protruding member, the first protruding member disposed between the first portion and the circuit substrate at a first protruding member distance from an end portion of the first portion, and the second protruding member disposed between the second portion and the circuit substrate at a second protruding member distance from an end portion of the second portion;

wherein pressing the protruding members between the first portion and the second portion and the circuit substrate provides a second spring bias on the thermal management apparatus to thermally couple the thermal management apparatus with the heat generating component.

13. The circuit assembly of claim 12 , wherein the first spring bias includes a constant spring rate.

14. The circuit assembly of claim 12 , wherein the second spring bias includes a variable spring rate.

15. The circuit assembly of claim 12 , wherein the protruding member distance relative to a length of the arms defines the second spring bias.

16. The circuit assembly of claim 15 , wherein the protruding member distance is adjustable to vary the second spring bias.

17. The circuit assembly of claim 12 , further comprising a center portion defined by the coupling of inner ends of the plurality of arms, the center portion having a locator pin configured to engage with a corresponding aperture in the circuit substrate.

18. The circuit assembly of claim 12 , wherein the thermal management apparatus comprises a heat sink having a plurality of fins.

19. The circuit assembly of claim 18 , wherein the thermal management apparatus further comprises a fan.

20. A method of thermally coupling a thermal management apparatus to at least one heat generating component of a circuit substrate, the method comprising:

thermally coupling the thermal management apparatus to the heat generating component with a first spring bias;

maintaining the thermal coupling of the thermal management apparatus to the heat generating component with a second pivot based spring bias when the thermal management apparatus moves relative to the heat generating component; and

wherein maintaining the thermal coupling of the thermal management apparatus with the heat generating component is provided by a first protruding member.

21. The method of claim 20 , wherein thermally coupling the thermal management apparatus with the heat generating component is provided by a device having at least a first portion and a at least a second portion adapted to couple the thermal management device to the heat generating component.

22. The method of claim 20 , wherein the first spring bias includes a constant spring rate.

23. The method of claim 20 , wherein the second spring bias includes a variable spring rate.

24. A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate, the device comprising:

at least a first portion adapted to couple to the thermal management apparatus;

at least a second portion adapted to couple to the thermal management apparatus, the first portion and the second portion symmetrically arranged relative to each other;

wherein the first portion and the second portion are adapted to thermally couple the thermal management apparatus with the heat generating component with a first spring bias;

wherein the first portion and the second portion are adapted to maintain the thermal management apparatus thermally coupled with the heat generating component with a second and pivot based spring bias provided in response to deflection of the device; and

a center portion defined by the coupling of inner ends of the first portion and the second portion, the center portion having a locator pin configured to engage with a corresponding aperture in a circuit substrate.

25. A method of thermally coupling a thermal management apparatus to at least one heat generating component of a circuit substrate, the method comprising:

thermally coupling the thermal management apparatus to the heat generating component with a first spring bias;

maintaining the thermal coupling of the thermal management apparatus to the heat generating component with a second pivot based spring bias when the thermal management apparatus moves relative to the heat generating component; and

wherein a protruding member distance relative to a length of the arms defines the second spring bias.

26. The method of claim 25 , wherein the protruding member distance is adjustable to vary the second spring bias.