IP Library Granted Patent US 7,083,431
Granted Patent B1
US 7,083,431 · App. 11/162,230 · Granted Aug 1, 2006

Method and system of electrically connecting multiple printed circuit boards

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Quick Facts
Patent No.
US 7,083,431
App. No.
11/162,230
Granted
Aug 1, 2006
Kind
B1
Abstract

Method and system of electrically connecting multiple printed circuit boards (PCBs). A pin may be used for establishing electrical connecting the PCBs. The PCBs may include one or more openings for receiving one or more corresponding pins. The pins may include securing and alignment features to facilitate proper securing and assembly.

Claims (34)

1. A system for solderlessly providing an electrical connection between at least two printed circuit boards (PCBs), the system comprising:

at least one PCB operatively configured with a complimentary alignment feature,

an electrically conducting pin having multiple securing features, wherein the pin includes at least one securing feature for each PCB, and the pin further includes a first alignment feature to facilitate orientating insertion of the pin through the complimentary alignment feature of the one PCB; and

a second alignment feature orienting the pin relative to each PCB wherein,

the first, second and complimentary alignment features in concert, define a singular orientation of the pin to the PCBs.

2. The system of claim 1 wherein at least one of the securing features is a press-fit feature configured to secure the pin through forceful exertion against at least one of the PCBs.

3. The system of claim 2 wherein the press-fit feature and the first alignment feature are located proximate a common end of the pin.

4. The system of claim 1 wherein each PCB includes an opening for receiving the pin and providing an electrical connection thereto.

5. The system of claim 4 wherein the first alignment feature cooperating with the complimentary alignment feature in concert with the securing features facilitates the single orientation wherein the pin inserts into and through the PCB opening.

6. The system of claim 4 wherein the openings are circular openings.

7. The system of claim 6 wherein the second alignment feature is a circular opening configured to cooperate with an adjacent circular opening.

8. The system of claim 7 wherein at least a portion of a circumference of the opening of the second alignment feature intersects with at least a portion of a circumference of the adjacent circular opening.

9. The system of claim 1 wherein each of the securing features are press-fit features configured to secure the pin through forceful exertion against at least one of the PCBs.

10. The system of claim 1 wherein each end of the pin includes securing features and the securing feature at one end of the pin is larger than the securing feature at the other end of the pin.

11. The system of claim 1 wherein the first alignment feature is separate from the securing features.

12. The system of claim 1 wherein the pin includes a connection feature at one end for receiving a mating feature, wherein the alignment features are configured to require the connection feature end of the pin to extend from a top-side of the one PCB when properly assembled.

13. A system for solderlessly providing an electrical connection between at least two printed circuit boards (PCBs), the system comprising:

at least one PCB operatively configured with a complimentary alignment feature,

a electrically conducting pin having multiple securing features, wherein the pin includes at least one securing feature for each PCB, and the pin further includes a first alignment feature to facilitate orienting insertion of the pin through the complimentary alignment feature of the one PCB;

a second alignment feature to facilitate orienting the pin relative to each PCB;

wherein each PCB includes a circular opening for receiving the pin and providing an electrical connection thereto;

wherein the complimentary alignment feature is a circular opening configured to cooperate with one of the other circular openings; and

wherein at least a portion of a circumference of the opening of the complimentary alignment feature intersects with at least a portion of a circumference of an adjacent circular opening.

14. The system of claim 13 wherein at least one of the securing features is press-fit feature configured to secure the pin through forceful exertion within an opening of at least one of the PCBs.

15. The system of claim 13 wherein the first alignment feature cooperating with the complimentary alignment feature in concert with the securing features facilitates the single orientation wherein the pin inserts into and through the PCB opening.

16. The system of claim 13 wherein each of the securing features are press-fit features configured to secure the pin through forceful exertion within an opening of at least one of the PCBs.

17. The system of claim 13 wherein each end of the pin includes securing features and the securing feature at one end of the pin is larger than the securing feature at the other end of the pin.

18. The system of claim 13 wherein the first alignment feature is separate from the securing features.

19. A method of solderlessly providing an electrical connection between at least two printed circuit boards (PCBs), the method comprising:

configuring each PCB to include openings for receiving an electrically conducting pin having properties sufficient for providing the electrical connection between the PCBs;

configuring one of the PCBs to include a complimentary alignment feature, the complimentary alignment feature cooperating with at least one of the openings;

configuring press-fit securing features for securing the pin through forceful exertion within the openings; and

configuring cooperation between the first alignment feature and the complimentary alignment feature in concert with the securing features to facilitate one-way insertion of the pin into the PCB openings.

20. The method of claim 19 further comprising providing the electrical connection by sequentially executing the following operations: inserting an end of the pin furthest from the first alignment feature into the opening associated with the complimentary alignment feature; moving the pin through the opening associated with the complimentary alignment feature until the first alignment feature prevents further insertion; rotating the pin to align the first alignment feature with the complimentary alignment feature; and further inserting the pin through the opening associated with the complimentary alignment feature until the press-fit features of the pin secure the pin within the PCB openings.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Feb 5, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037702/0911 →
RELEASE OF SECURITY INTEREST Recorded Feb 4, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037701/0180 →
RELEASE OF SECURITY INTEREST Recorded Feb 4, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037701/0251 →
RELEASE OF SECURITY INTEREST Recorded Feb 4, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037701/0340 →
RELEASE OF SECURITY INTEREST Recorded Apr 25, 2014
From: JPMORGAN CHASE BANK, N.A.
To: LEAR CORPORATION
Reel/Frame 032770/0843 →
RELEASE OF SECURITY INTEREST Recorded Apr 21, 2014
From: JPMORGAN CHASE BANK, N.A.
To: LEAR CORPORATION
Reel/Frame 032722/0553 →
SECURITY INTEREST Recorded Mar 20, 2013
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 030076/0016 →
GRANT OF FIRST LIEN SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 16, 2009
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
Reel/Frame 023519/0267 →
GRANT OF SECOND LIEN SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 16, 2009
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
Reel/Frame 023519/0626 →
SECURITY AGREEMENT Recorded Jun 23, 2006
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS GENERAL ADMINISTRATIVE AGENT
Reel/Frame 017858/0719 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2005
From: DARR, CHRISTOPHER J.; KOWTUN, PETER
To: LEAR CORPORATION
Reel/Frame 016486/0614 →