Device to protect an active implantable medical device feedthrough capacitor from stray laser weld strikes, and related manufacturing process
View Patent ↗An insulative shield is co-bonded to the top of a ceramic capacitor in a feedthrough terminal assembly on an active implantable medical device. The insulative shield is a thin substrate that provides protection against damage and degradation of the feedthrough capacitor and/or its conformal coating from heat, splatter or debris resulting from the electromechanical connection of components during construction of the assembly. Laser welding, thermal or ultrasonic bonding, soldering, brazing or related lead attachment techniques can create such heat, splatter or debris. In a preferred embodiment, the insulative shield is co-bonded using the capacitor's own conformal coating.
1. A process for manufacturing a feedthrough terminal assembly for an active implantable medical device, comprising the steps of:
associating a feedthrough capacitor with a conductive ferrule, the feedthrough capacitor having first and second sets of electrode plates, wherein the second set of electrode plates is conductively coupled to the ferrule;
passing a terminal pin or leadwire through the ferrule in non-conductive relation and through the feedthrough capacitor in conductive relation with the first set of electrode plates;
placing an insulative shield over a surface of the feedthrough capacitor; and
conductively coupling electronic circuitry for the active implantable medical device to the terminal pin or leadwire, wherein the insulative shield protects the surface of the feedthrough capacitor from heat, splatter or debris occasioned by said coupling of the electronic circuitry to the terminal pin or leadwire.
2. The process of claim 1 , wherein the insulative shield comprises a circuit board, ceramic, alumina-oxide, Fosterite, alumina, BT epoxy, berrylia alumina oxide, polyimide, modified polyimide, cyanate ester, composite epoxy, multifunctional epoxy, tetra-functional epoxy, modified epoxy or standard epoxy.
3. The process of claim 2 , wherein the circuit board comprises resin reinforced by fabric cloth.
4. The process of claim 3 , wherein the resin comprises epoxy, polyimide, or cyanate ester.
5. The process of claim 3 , wherein the fabric cloth comprises fiberglass.
6. The process of claim 1 , including the step of co-bonding the insulative shield to the feedthrough capacitor using a conformal coating on the feedthrough capacitor.
7. The process of claim 6 , wherein the conformal coating comprises a non-conductive polymer, a thermal setting epoxy, or a polyimide.
8. The process of claim 1 , wherein the active implantable medical device comprises a cardiac pacemaker, an implantable defibrillator, a congestive heart failure device, a hearing implant, a cochlear implant, a neurostimulator, a drug pump, a ventricular assist device, an insulin pump, a spinal cord stimulator, an implantable sensing system, a deep brain stimulator, an artificial heart, an incontinence device, a vagus nerve stimulator, a bone growth stimulator, a gastric pacemaker, or a prosthetic device.
9. The process of claim 1 , wherein the conductive coupling comprises laser welding, thermal or ultrasonic bonding, soldering, or brazing.
10. The process of claim 1 , including the step of attaching a conductive pad to the terminal pin or lead wire, wherein the electronic circuitry is conductively coupled to the conductive pad.
11. The process of claim 10 , including the step of supporting the conductive pad in spaced relation above the feedthrough capacitor by an assembly housing over the feedthrough terminal assembly.
12. The process of claim 10 , wherein the conductive pad comprises a wire bond pad.
13. A process for manufacturing a feedthrough terminal assembly for an active implantable medical device, comprising the steps of:
associating a feedthrough capacitor with a conductive ferrule, the feedthrough capacitor having first and second sets of electrode plates, wherein the second set of electrode plates is conductively coupled to the ferrule;
passing a terminal pin or leadwire through the ferrule in non-conductive relation and through the feedthrough capacitor in conductive relation with the first set of electrode plates;
placing an insulative shield over a surface of the feedthrough capacitor;
co-bonding the insulative shield to the feedthrough capacitor using a conformal coating on the feedthrough capacitor; and
laser welding, thermal or ultrasonic bonding, soldering, or brazing electronic circuitry for the active implantable medical device to the terminal pin or leadwire, wherein the insulative shield protects the surface of the feedthrough capacitor from heat, splatter or debris occasioned by said coupling of the electronic circuitry to the terminal pin or leadwire.
14. The process of claim 13 , wherein the insulative shield comprises a circuit board, ceramic, alumina-oxide, Fosterite, alumina, BT epoxy, berrylia alumina oxide, polyimide, modified polyimide, cyanate ester, composite epoxy, multifunctional epoxy, tetra-functional epoxy, modified epoxy or standard epoxy.
15. The process of claim 14 , wherein the circuit board comprises resin reinforced by fabric cloth.
16. The process of claim 15 , wherein the resin comprises epoxy, polyimide, or cyanate ester.
17. The process of claim 15 , wherein the fabric cloth comprises fiberglass.
18. The process of claim 13 , wherein the conformal coating comprises a non-conductive polymer, a thermal setting epoxy, or a polyimide.
19. The process of claim 13 , wherein the active implantable medical device comprises a cardiac pacemaker, an implantable defibrillator, a congestive heart failure device, a hearing implant, a cochlear implant, a neurostimulator, a drug pump, a ventricular assist device, an insulin pump, a spinal cord stimulator, an implantable sensing system, a deep brain stimulator, an artificial heart, an incontinence device, a vagus nerve stimulator, a bone growth stimulator, a gastric pacemaker, or a prosthetic device.
20. The process of claim 13 , including the step of attaching a conductive pad to the terminal pin or lead wire, wherein the electronic circuitry is conductively coupled to the conductive pad.
21. The process of claim 20 , including the step of supporting the conductive pad in spaced relation above the feedthrough capacitor by an assembly housing over the feedthrough terminal assembly.
22. The process of claim 20 , wherein the conductive pad comprises a wire bond pad.
23. A feedthrough terminal assembly for an active implantable medical device, comprising:
a feedthrough capacitor having first and second sets of electrode plates, wherein the second set of electrode plates is conductively coupled to a conductive ferrule;
a terminal pin or leadwire passing through the conductive ferrule in non-conductive relation and through the feedthrough capacitor in conductive relation with the first set of electrode plates;
an insulative shield on a surface of the feedthrough capacitor; and
electronic circuitry for the active implantable medical device conductively coupled to the terminal pin or leadwire, wherein the insulative shield protects the surface of the feedthrough capacitor from heat, splatter or debris occasioned by said coupling of the electronic circuitry to the terminal pin or leadwire.
24. The feedthrough terminal assembly of claim 23 , wherein the insulative shield comprises a circuit board, ceramic, alumina-oxide, Fosterite, alumina, BT epoxy, berrylia alumina oxide, polyimide, modified polyimide, cyanate ester, composite epoxy, multifunctional epoxy, tetra-functional epoxy, modified epoxy or standard epoxy.
25. The feedthrough terminal assembly of claim 24 , wherein the circuit board comprises resin reinforced by fabric cloth.
26. The feedthrough terminal assembly of claim 25 , wherein the resin comprises epoxy, polyimide, or cyanate ester.
27. The feedthrough terminal assembly of claim 25 , wherein the fabric cloth comprises fiberglass.
28. The feedthrough terminal assembly of claim 23 , including a conformal coating on the feedthrough capacitor, wherein the conformal coating co-bonds the insulative shield to the feedthrough capacitor.
29. The feedthrough terminal assembly of claim 28 , wherein the conformal coating comprises a non-conductive polymer, a thermal setting epoxy, or a polyimide.
30. The feedthrough terminal assembly of claim 23 , wherein the active implantable medical device comprises a cardiac pacemaker, an implantable defibrillator, a congestive heart failure device, a hearing implant, a cochlear implant, a neurostimulator, a drug pump, a ventricular assist device, an insulin pump, a spinal cord stimulator, an implantable sensing system, a deep brain stimulator, an artificial heart, an incontinence device, a vagus nerve stimulator, a bone growth stimulator, a gastric pacemaker, or a prosthetic device.
31. The feedthrough terminal assembly of claim 23 , wherein the electronic circuitry is conductively coupled to the terminal pin or leadwire by laser welding, thermal or ultrasonic bonding, soldering, or brazing.
32. The process of claim 23 , including a conductive pad conductively coupled to the terminal pin or lead wire and conductively coupled to the electronic circuitry.
33. The process of claim 32 , including an assembly housing over the feedthrough terminal assembly, wherein the assembly housing supports the conductive pad in spaced relation above the feedthrough capacitor.
34. The process of claim 32 , wherein the conductive pad comprises a wire bond pad.
35. A feedthrough terminal assembly for an active implantable medical device, comprising:
a feedthrough capacitor having first and second sets of electrode plates, wherein the second set of electrode plates is conductively coupled to a conductive ferrule;
a terminal pin or leadwire passing through the conductive ferrule in non-conductive relation and through the feedthrough capacitor in conductive relation with the first set of electrode plates;
an insulative shield on a surface of the feedthrough capacitor;
a conformal coating on the feedthrough capacitor, wherein the conformal coating co-bonds the insulative shield to the feedthrough capacitor; and
electronic circuitry for the active implantable medical device conductively coupled to the terminal pin or leadwire by laser welding, thermal or ultrasonic bonding, soldering, or brazing, wherein the insulative shield protects the surface of the feedthrough capacitor from heat, splatter or debris occasioned by said coupling of the electronic circuitry to the terminal pin or leadwire.
36. The feedthrough terminal assembly of claim 35 , wherein the insulative shield comprises a circuit board, ceramic, alumina-oxide, Fosterite, alumina, BT epoxy, berrylia alumina oxide, polyimide, modified polyimide, cyanate ester, composite epoxy, multifunctional epoxy, tetra-functional epoxy, modified epoxy or standard epoxy.
37. The feedthrough terminal assembly of claim 36 , wherein the circuit board comprises resin reinforced by fabric cloth.
38. The feedthrough terminal assembly of claim 36 , wherein the resin comprises epoxy, polyimide, or cyanate ester.
39. The feedthrough terminal assembly of claim 36 , wherein the fabric cloth comprises fiberglass.
40. The feedthrough terminal assembly of claim 35 , wherein the conformal coating comprises a non-conductive polymer, a thermal setting epoxy, or a polyimide.
41. The feedthrough terminal assembly of claim 35 , wherein the active implantable medical device comprises a cardiac pacemaker, an implantable defibrillator, a congestive heart failure device, a hearing implant, a cochlear implant, a neurostimulator, a drug pump, a ventricular assist device, an insulin pump, a spinal cord stimulator, an implantable sensing system, a deep brain stimulator, an artificial heart, an incontinence device, a vagus nerve stimulator, a bone growth stimulator, a gastric pacemaker, or a prosthetic device.
42. The process of claim 35 , including a conductive pad conductively coupled to the terminal pin or lead wire and conductively coupled to the electronic circuitry.
43. The process of claim 42 , including an assembly housing over the feedthrough terminal assembly, wherein the assembly housing supports the conductive pad in spaced relation above the feedthrough capacitor.
44. The process of claim 42 , wherein the conductive pad comprises a wire bond pad.