Process for manufacturing an LED lamp with integrated heat sink
A method for manufacturing an LED lamp assembly includes anodizing at least a portion of a surface of an electrically and thermally conductive base, such as an aluminum or aluminum alloy base, so as to form an electrically insulating coating. The base may form a heat sink or be coupled to a heat sink. Circuit traces are formed on the anodized surface of the base, which include LED landings. LEDs are electrically and mechanically attached to the LED landing by a conductive metallic solder such that heat generated from the LED is transferred efficiently through the solder and circuit traces LED landings to the base and heat sink through a metal-to-metal contact pathway.
1. A method for manufacturing an LED lamp assembly, comprising the steps of:
anodizing at least a portion of a surface of an electrically and thermally conductive base so as to form an electrically insulating coating;
forming circuit traces on the anodized surface of the base to establish discrete and electrically conductive paths for electrically interconnecting electronic components, the circuit traces including at least one LED landing; and
electrically and mechanically attaching an LED directly to the LED landing by means of conductive metallic solder, whereby heat generated from the LED is transferred through the solder and circuit trace LED landing and to the base.
2. The method of claim 1 , wherein the base is comprised of aluminum or an aluminum alloy, and the anodizing step includes the step of forming an aluminum oxide coating on the base.
3. The method of claim 2 , wherein the base comprises a heat sink.
4. The method of claim 3 , including the step of forming heat dissipating fins with the base.
5. The method of claim 4 , wherein the fins extend from a surface of the base generally opposite the circuit traces.
6. The method of claim 2 , including the step of coupling the base to a heat sink.
7. The method of 6 , including the step of disposing a heat conductive material between the base and the heat sink.
8. The method of claim 7 , wherein the heat conductive material comprises a metallic-based paste.
9. The method of claim 1 , wherein the metallic solder comprises a tin alloy material.
10. The method of claim 9 , wherein the solder comprises tin and lead, copper, or silver.
11. The method of claim 1 , including the step of disposing a lens and a reflector over the LED, the lens and reflector cooperatively dispersing light emitted from the LED.
12. A method for manufacturing an LED lamp assembly, comprising the steps of:
anodizing at least a portion of a surface of an electrically and thermally conductive aluminum or aluminum alloy base comprising a heat sink so as to form an electrically insulating aluminum oxide coating thereon;
forming circuit traces on the anodized surface of the heat sink base to establish discrete and electrically conductive paths for electrically interconnecting electronic components, the circuit traces including at least one LED landing; and
electrically and mechanically attaching an LED directly to the circuit trace LED landing by means of conductive metallic solder, whereby heat generated from the LED is transferred through the solder and circuit trace LED landing and to the heat sink base.
13. The method of claim 12 , including the step of forming heat dissipating fins with the base.
14. The method of claim 13 , wherein the fins extend from a surface of the base generally opposite the circuit traces.
15. The method of claim 12 , wherein the solder comprises a tin alloy material.
16. The method of claim 15 , wherein the solder comprises tin and lead, copper, or silver.
17. The method of claim 12 , including the step of disposing a lens and a reflector over the LED, the lens and reflector cooperatively dispersing light emitted from the LED.
18. A method for manufacturing an LED lamp assembly, comprising the steps of:
anodizing at least a portion of a surface of an electrically and thermally conductive aluminum or aluminum alloy metal base so as to form an electrically insulating aluminum oxide coating;
forming circuit traces on the anodized surface of the metal base to establish discrete and electrically conductive paths for electrically interconnecting electronic components, the circuit traces including at least one LED landing;
electrically and mechanically attaching an LED directly to the circuit trace LED landing by means of conductive metallic solder;
coupling the metal base to a metal heat sink; and
disposing a heat conductive material between the metal base and the heat sink;
whereby heat generated from the LED is transferred through the solder and circuit trace LED landing and metal base to the heat sink.
19. The method of claim 18 , wherein the heat conductive material comprises a metallic-based paste.
20. The method of claim 18 , wherein the solder comprises a tin alloy material.
21. The method of claim 20 , wherein the solder comprises tin and lead, copper, or silver.
22. The method of claim 18 , including the step of disposing a lens and a reflector over the LED, the lens and reflector cooperatively dispersing light emitted from the LED.