IP Library Granted Patent US 7,209,360
Granted Patent B1
US 7,209,360 · App. 11/163,759 · Granted Apr 24, 2007

Leak-tight system for boxes containing electrical and electronic components

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Quick Facts
Patent No.
US 7,209,360
App. No.
11/163,759
Granted
Apr 24, 2007
Kind
B1
Abstract

The system consists of fixing the printed circuit board ( 3 ) to the bottom ( 1 ) of the body of the box with the cooperation of a perimetral and spacing flap ( 6 ) which creates a chamber ( 7 ) under the board ( 3 ), in which the components ( 4 ) associated to the lower side of said board are housed, subsequently filling the outer perimetral space of said flap ( 6 ) with a resin mass ( 8 ), which is applied in liquid state and solidifies immediately afterwards, such that said resin ( 8 ) perfectly seals the chamber ( 7 ), while at the same time provides a thick protective layer on the upper side of the printed circuit board ( 3 ), also protecting the latter, which allows for the cover ( 2 ) of the box to have openings for ventilation of certain components ( 4 ′) which generate a remarkable amount of heat.

Claims (12)

1. A leak-fight system for boxes containing electrical and electronic components comprising in cooperative combination:

a) a box body ( 1 ) having a bottom and sidewalls ( 9 ), said sidewalls having perimetral flap ( 6 );

b) a complementary cover ( 2 );

c) a printed circuit board ( 3 ) having an upper and a lower surface with electrical and electronic components ( 4 ) mounted upon both said upper and said lower surfaces, dimensioned to mount within said box ( 1 ) on said perimetral flap ( 6 ) defining a chamber ( 7 ) housing said electronic components ( 4 ) mounted on said printed circuit board ( 3 ) lower surface; and

d) a resin mass ( 8 ) poured in liquid state onto said circuit board ( 3 ) upper surface filling the space defined by said printed circuit board ( 3 ) upper surface, said perimetral flap ( 6 ) and said sidewalls ( 9 ) and solidifying thereon, thereby forming a humidity protective layer over said printed circuit board upper surface and sealing said chamber ( 7 ); and

said leak tight system further characterized as having a second printed circuit board ( 3 ′) arranged in a vertical position inside the box ( 1 ) in a side receptacle defined by a partition wall ( 13 ) having a height exceeding the upper edge of said second printed circuit board ( 3 ′), suitable to be covered by resin ( 8 ).

2. A leak-tight system for boxes containing electrical and electronic components according to claim 1 , characterized in that said printed circuit board ( 3 ) is fixed to said body ( 1 ) of the box by means of screws situated outside of said perimetral flap ( 6 ), in the receiving area of the resin mass ( 8 ), having inside said perimetral flap ( 6 ) a second flap ( 6 ′) defining a channel ( 7 ′) surrounding said chamber ( 7 ) in which said lower components ( 4 ) of said printed circuit board are housed, said channel ( 7 ′) acting as a resin ( 8 ) overflow catching device.

3. A leak-tight system for boxes containing electrical and electronic components according to one of claims 1 or 2 , characterized in that said cover ( 2 ) incorporates windows ( 10 ) operatively opposite heat-dissipating components ( 4 ′), such that said heat-dissipating components ( 4 ″) are in the open air, partially projecting to the exterior through said windows.

4. A leak-tight system for boxes containing electrical and electronic components according to one of claims 1 or 2 , characterized in that said box ( 1 ) has drainage grooves ( 12 ) on its perimeter.

5. A leak-tight system for boxes containing electrical and electronic components according to one of claims 1 or 2 , characterized in that said box ( 1 ) has a chamber ( 11 ) housing components requiring accessibility having an upper portion and a lower portion, said chamber ( 11 ) being sealed at its lower portion by said resin ( 16 ) and having a geometry allowing for access to said components in its upper portion.

6. A leak-tight system for boxes containing electrical and electronic components according to claim 5 , characterized in that said chamber ( 11 ) is independent from the body of the box ( 1 ).

7. A leak-tight system for boxes containing electrical and electronic components according to claim 5 , characterized in that said chamber ( 11 ) is within said box ( 1 ) body.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Feb 5, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037702/0911 →
RELEASE OF SECURITY INTEREST Recorded Feb 4, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037701/0180 →
RELEASE OF SECURITY INTEREST Recorded Feb 4, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037701/0251 →
RELEASE OF SECURITY INTEREST Recorded Feb 4, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037701/0340 →
RELEASE OF SECURITY INTEREST Recorded Apr 25, 2014
From: JPMORGAN CHASE BANK, N.A.
To: LEAR CORPORATION
Reel/Frame 032770/0843 →
SECURITY INTEREST Recorded Mar 20, 2013
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 030076/0016 →
GRANT OF FIRST LIEN SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 16, 2009
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
Reel/Frame 023519/0267 →
GRANT OF SECOND LIEN SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 16, 2009
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
Reel/Frame 023519/0626 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 28, 2005
From: YARZA, JORGE GIMENEZ
To: LEAR CORPORATION
Reel/Frame 016702/0406 →