Pixel structure
View Patent ↗A pixel structure comprises a substrate, a first metal layer, a dielectric layer, a semiconductor layer, a second metal layer, a patterned floating metal layer and a pixel electrode. The first metal layer, disposed on the substrate, comprises a gate and a scan line electrically thereto. The dielectric layer, overlapped by the semiconductor layer, is disposed on the substrate and overlapping the first metal layer. The second metal layer comprises a source/drain, disposed on the semiconductor layer and partially overlaps the gate, and a data line, electrically connects to the source and partially overlapped with the scan line. The pixel electrode electrically connects to the drain. Additionally, the patterned floating metal layer is disposed between the dielectric layer and the semiconductor layer, beneath the source/drain and partically overlapping the gate.
1. A pixel structure, comprising:
a substrate,
a first metal layer, disposed on the substrate and comprising a gate and a scan line electrically connected to the gate;
a dielectric layer, disposed on the substrate and overlapping the first metal layer;
a semiconductor layer, disposed on the dielectric layer located over the gate;
a second metal layer, comprising a source/drain, disposed on the semiconductor layer and partially overlapping the gate, and a data line, electrically connected to the source and partially overlapping the scan line;
a patterned floating metal layer, disposed between the dielectric layer and the semiconductor layer, beneath the source/drain, wherein a part of the patterned floating metal layer overlapping with the source is isolated from a part of the patterned floating metal layer overlapping with the drain; and
a pixel electrode, connected to the drain.
2. The pixel structure of claim 1 , further comprises a pad layer, disposed over the dielectric layer located between the scan line and the data line and the patterned floating metal layer disposed between the pad layer and the dielectric layer.
3. The pixel structure of claim 1 , wherein the pad layer and the semiconductor layer are formed on the same layer.
4. The pixel structure of claim 1 , wherein material of the patterned floating metal layer comprises transparent metal.
5. The pixel structure of claim 1 , wherein material of the patterned floating metal layer comprises opaque metal.
6. The pixel structure of claim 1 , wherein the thickness of the patterned floating metal layer ranges from 100 angstrom to 1800 angstrom.
7. The pixel structure of claim 1 , wherein the thickness of the patterned floating metal layer ranges from 500 angstrom to 1500 angstrom.
8. The pixel structure of claim 1 , wherein the semiconductor layer comprises a channel layer and an ohmic contact layer disposed on the channel layer.
9. The pixel structure of claim 1 , further comprising a protection layer, disposed on the substrate and overlapping the first metal layer and the second layer.
10. The pixel structure of claim 9 , wherein the protection layer further comprises an opening for exposing the drain and the pixel electrode electrically connected to the drain through the opening of the protection layer.
11. The pixel structure of claim 1 , wherein the patterned floating metal layer is only disposed within an overlapping region between the first metal layer and the second metal layer.