IP Library Granted Patent US 7,468,515
Granted Patent B2
US 7,468,515 · App. 11/164,946 · Granted Dec 23, 2008

Ultra violet light sensor

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Quick Facts
Patent No.
US 7,468,515
App. No.
11/164,946
Granted
Dec 23, 2008
Kind
B2
Abstract

A light detector having spaced electrodes preset by pins or a spacer within a sealed enclosure. The detector may have a MEMS structure that is separate from the sealing of the enclosure. Further, the detector may have a lens for the transmission of light onto the elements. The lens may be coated to affect the amount of light admitted into the enclosure. Light detectable by the sensor may be ultra-violet.

Claims (45)

1. A sensor assembly comprising:

a cathode;

a MEMS structure including a silicon substrate and an anode layer extending over at least a portion of the silicon substrate, the silicon substrate further having an opening extending through the silicon substrate below the anode leaving the anode layer suspended across the opening, the MEMS structure situated above the cathode with the anode layer spaced from the cathode;

a plate, wherein the cathode is positioned between the plate and the MEMS structure;

an enclosure attached to the plate and hermetically sealing the cathode and the MEMS structure within the enclosure; and

the enclosure having a light transmissive window proximate to the anode.

2. The assembly of claim 1 , further comprising an optical coating formed on the window so that the sensor assembly operates in a non-saturated mode to be a radiometer.

3. The assembly of claim 1 , comprising an optical coating formed on the window wherein the coating reduces light transmissive characteristics so that the sensor assembly operates in a proportional mode.

4. The assembly of claim 1 , wherein the sensor assembly is a radiometer.

5. The assembly of claim 1 , wherein the anode layer includes is a light transmissive conductive material.

6. The assembly of claim 1 , wherein the anode layer comprises a plurality of openings.

7. The assembly of claim 1 , wherein the sensor assembly is for detecting UV light.

8. A sensor assembly comprising:

a base;

a MEMS structure including a first substrate and an anode layer extending over at least a portion of a first side of the first substrate, the first substrate further having an opening extending through the first substrate below the anode leaving the anode layer suspended across the opening, the MEMS structure further having a second substrate bonded to a second side of the first substrate, the second substrate including a cathode layer extending across at least a portion of the second substrate in registration with at least part of the opening in the first substrate;

the MEMS structure situated adjacent the base;

a container having an open first end and a second end with a window; and

wherein the first end of the container is attached to the base resulting in sealing the MEMS structure within the container and base.

9. The assembly of claim 8 , further comprising an optical coating formed on the window so that the sensor assembly operates in a non-saturated mode.

10. The assembly of claim 8 , further comprising an optical coating formed on the window so that the sensor assembly operates in a proportional mode.

11. The assembly of claim 10 , wherein the sensor assembly operates as a radiometer.

12. The sensor of claim 8 , wherein the anode layer is UV light transmissive.

13. A sensor assembly comprising:

a header;

a first substrate situated on the header;

a cathode situated on the first substrate;

a second substrate forming an aperture therethrough situated on the first substrate;

an anode layer situated on the second substrate and extending across the aperture; and

a window adjacent the anode; and

wherein:

the window is light transmissive;

the anode is light transmissive;

the window, the first substrate and the second substrate form a first sealed volume defined by the aperture; and

the window, the anode layer, the first substrate and the second substrate are bonded together forming a layered MEMS structure.

14. The sensor assembly of claim 13 , further comprising:

an enclosure having an open end situated on the header, wherein the enclosure defines a enclosure window; and

wherein the enclosure encompasses the window, the anode layer, the first substrate and the second substrate of the MEMS structure.

15. The sensor assembly of claim 14 wherein the enclosure forms a second sealed volume about the MEMS structure.

16. The sensor assembly of claim 15 , wherein:

the first sealed volume comprises H 2 and an inert gas; and

the second sealed volume comprises H 2 and an inert gas.

17. The sensor assembly of claim 16 , wherein:

the first sealed volume has a pressure between 80 and 120 Torr; and

the second sealed volume has a pressure between 600 and 900 Torr.

18. The sensor assembly of claim 17 , wherein a distance between the anode and the cathode is between 0.005 and 0.100 inch.

Assignments (4)
CHANGE OF NAME Recorded Jun 12, 2025
From: ADEMCO INC.
To: RESIDEO LLC
Reel/Frame 071546/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2021
From: HONEYWELL INTERNATIONAL INC.
To: ADEMCO INC.
Reel/Frame 056522/0420 →
SECURITY INTEREST Recorded Oct 26, 2018
From: ADEMCO INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 047337/0577 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2006
From: COLE, BARRETT E.; HIGASHI, ROBERT E.; BARTELS, JAMES; PLANER, NORM; SWENSON, GREGG
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 018020/0800 →