Cure system, adhesive system, electronic device
View Patent ↗A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided.
1. A cure system, comprising:
a curing agent that is a low temperature liquid; and
a finely divided refractory solid, wherein the solid has an active termination site density that is less than about 5 per square nanometer and, wherein the solid is non-reactive relative to the curing agent.
2. The cure system as defined in claim 1 , wherein the solid is compatibilized and passivated.
3. The cure system as defined in claim 2 , wherein the curing agent comprises an anhydride.
4. The cure system as defined in claim 3 , wherein the anhydride comprises one or more aromatic carboxylic acid anhydride, aliphatic carboxylic acid anhydride, cycloaliphatic carboxylic acid anhydride, or siloxane dianhydride.
5. The cure system as defined in claim 3 , wherein the anhydride comprises one or more of benzoic anhydride; phthalic anhydride; hexahydro phthalic anhydride; methyl-hexahydro phthalic anhydride (MHHPA); 4-nitrophthalic anhydride; naphthalene tetracarboxylic acid dianhydride; naphthalic anhydride; tetrahydro phthalic anhydride; cyclohexane dicarboxylic anhydride; butanoic anhydride; dodecenyl succinic anhydride; 2,2-dimethyl glutaric anhydride; ethanoic anhydride; glutaric anhydride; hexafluoro glutaric acid anhydride; itaconic anhydride; tetrapropenylsuccinic anhydride; maleic anhydride; 2-methyl glutaric anhydride; 2-methyl propionic anhydride 1,2-cyclohexane dicarboxylic anhydride; octadecyl succinic anhydride; 2-octenyl succinic anhydride; n-octenyl succinic anhydride; 2-phenylglutaric anhydride; propionic acid anhydride; 3,3-tetramethylene glutaric anhydride; or derivatives thereof.
6. The cure system as defined in claim 1 , wherein the curing agent is a liquid at a temperature in a range of less that about 100 degrees Celsius.
7. The cure system as defined in claim 6 , wherein the curing agent is a liquid at a temperature in a range of less that about 50 degrees Celsius.
8. The cure system as defined in claim 7 , wherein the curing agent is a liquid at a temperature in a range of from about 25 degrees Celsius to about 35 degrees Celsius.
9. The cure system as defined in claim 1 , wherein the refractory solid comprises silica.
10. The cure system as defined in claim 9 , wherein the silica comprises silica particles.
11. The cure system as defined in claim 10 , wherein the silica particles have an average particle size that is nano-scale.
12. The cure system as defined in claim 11 , wherein the silica particles have an average particle size in a range of less than about 100 nanometers.
13. The cure system as defined in claim 1 , further comprising a catalyst or an accelerator.
14. The cure system as defined in claim 1 , further comprising one or more of pigment, reactive diluent, defoamer, flow modifier, flexibilizer, or flame retardant.
15. The cure system as defined in claim 1 , further comprising an adhesion promoter.
16. The cure system as defined in claim 1 , wherein the solid comprises one or both of alumina or boron nitride.
17. The cure system as defined in claim 1 , wherein the solid is present in an amount in a range of greater than about 30 weight percent based on the total weight of the composition.
18. The cure system as defined in claim 17 , wherein the solid is present in an amount in a range of from about 30 weight percent to about 70 weight percent based on the total weight of the composition.
19. An adhesive system comprising the cure system as defined in claim 1 , and further comprising a curable resin.
20. The adhesive system as defined in claim 19 , wherein the curable resin comprises one or more epoxy or oxirane moiety.
21. The adhesive system as defined in claim 20 , wherein the epoxy comprises one or more aliphatic epoxy resin, cycloaliphatic epoxy resin, or aromatic epoxy resin.
22. The adhesive system as defined in claim 19 , wherein the curable resin is present relative the cure system in a stoichiometric ratio in a range of about 1:1.
23. The adhesive system as defined in claim 19 , wherein the curable resin comprises a filler prior to mixing with the cure system.
24. A cured polymer layer comprising the adhesive system as defined in claim 19 .
25. An electronic device, comprising: a substrate; a chip secured to the substrate; and a cured polymer layer as defined in claim 24 disposed between the chip and the substrate.
26. A solvent-free adhesive system for use in an electronic device, comprising:
a curable resin comprising a first portion of refractory solid; and
a cure system operable to cure the resin, the cure system comprising a curing agent and a second portion of refractory solid, wherein the refractory solid is present in an amount greater than about 30 percent by weight relative to the total weight of the adhesive system and wherein the first and second portion of refractory solids each have an active termination site density that is less than about 5 per square nanometer.
27. The adhesive system as defined in claim 26 , wherein a mixture of the resin and the curing agent has a viscosity at about room temperature that is sufficiently low to enable application of the mixture to a substrate surface and to use as a no-flow underfill.