Printhead integrated circuit comprising thermal bend actuator
A printhead integrated circuit comprising a drive circuitry and a plurality of nozzles is provided. Each nozzle comprises a chamber for holding ink to be ejected, the chamber having an opening defined in a roof structure; and a thermal bend actuator for ejecting droplets of ink from the chamber through the opening. The bend actuator is configured as a cantilever with one end of the cantilever anchored to a base and the opposite end supporting a paddle. The actuator has a deflector section constructed of a material having a high coefficient of thermal expansion and a barrier layer constructed of a dielectric material having low thermal conductivity. A supply of current from the drive circuitry to the deflector section causes differential thermal expansion between the deflector section and the barrier layer, such that the actuator bends and the paddle ejects a droplet of ink from the nozzle.
1. A printhead integrated circuit comprising a drive circuitry and a plurality of nozzles, each nozzle comprising:
a chamber for holding ink to be ejected, the chamber having an opening defined in a roof structure;
a thermal bend actuator for ejecting droplets of ink from the chamber through the opening, the bend actuator being configured as a cantilever with one end of the cantilever anchored to a base and the opposite end supporting a paddle, the actuator having a deflector section constructed of a material having a high coefficient of thermal expansion and a barrier layer constructed of a dielectric material having low thermal conductivity;
wherein supply of current from the drive circuitry to the deflector section causes differential thermal expansion between the deflector section and the barrier layer such that the actuator bends and the paddle ejects a droplet of ink from the nozzle.
2. The printhead integrated circuit of claim 1 wherein the deflector section is configured to provide a spatial thermal pattern along the cantilever such that the resultant temperature change is greater at the base end of the cantilever than the paddle end of the cantilever.
3. The printhead integrated circuit of claim 2 wherein the deflector section is a first deflector layer and the device further comprises a second deflector layer, wherein the barrier layer is bonded between the first deflector layer and the second deflector layer such that the spatial heating pattern causes a substantially greater temperature increase of the base end than the paddle end of the first deflector layer.
4. The printhead integrated circuit of claim 3 wherein the second deflector layer is constructed of the same material as the first deflector layer and the second deflector layer is substantially equal in thickness to the first deflector layer.
5. The printhead integrated circuit of claim 2 wherein the deflector section is a thin film resistor layer and the spatial thermal pattern results in part from spatially modifying the conductivity of the thin film resistor layer.
6. An inkjet printhead comprising a plurality of printhead integrated circuits according to claim 1 .