Sputtering device with gas injection assembly

1 . A sputtering device, comprising:

a chamber; and

a substrate transferring unit for loading a substrate into, or unloading the substrate from the chamber, the substrate transferring unit comprising a gas injection assembly forming a gas cushion between the substrate and an upper surface of the substrate transferring unit.

2 . The sputtering device of claim 1 , wherein the substrate transferring unit includes:

a supporting unit for supporting a substrate;

a fixing unit for fixing one side of the substrate to the supporting unit; and

a roller for moving the substrate transferring unit.

3 . The device of claim 2 , wherein the substrate transferring unit is inclined by an angle when the substrate is transferred and a thin film is deposited onto the substrate.

4 . The device of claim 3 , wherein the gas injection assembly is mounted on the supporting unit, and controls a gas injection amount by detecting a distance between the substrate and the supporting unit.

5 . The device of claim 4 , wherein the gas injection assembly includes at least one nozzle group.

6 . The device of claim 5 , wherein the at least one nozzle group includes:

gas injection nozzles respectively having one injection opening and a plurality of inlets;

one gas flow amount controller spaced from the gas injection nozzles with a certain interval; and

at least one distance detecting sensor connected to the gas flow amount controller.

7 . The device of claim 6 , wherein the at least one nozzle group individually controls a gas flow amount inside the gas injection assembly by using a corresponding gas flow amount controller and a corresponding distance detecting sensor.

8 . The device of claim 6 , wherein the gas injection nozzle has a circular cross-section.

9 . The device of claim 6 , wherein the injection opening is arranged at a central portion of the gas injection nozzle.

10 . The device of claim 6 , wherein the injection opening has a gap between adjacent injection openings is about 10 mm or less.

11 . The device of claim 6 , wherein the plurality of inlets includes:

a plurality of first inlets radially formed around the injection opening at a first distance from the injection opening; and

a plurality of second inlets radially formed around the injection opening at a second distance from the injection opening.

12 . The device of claim 6 , wherein the plurality of inlets includes:

a first ring-shaped inlet surrounding the injection opening at a first distance from the injection opening; and

a second ring-shaped inlet surrounding the injection opening at a second distance from the injection opening.

13 . The device of claim 6 , wherein the gas injection nozzle includes:

a gas injection pipe connected to the injection opening for supplying gas to the substrate through the injection opening; and

a gas exhaustion pipe connected to the inlet for exhausting gas through the inlet.

14 . A liquid crystal device comprising a substrate including a thin film formed in the device of claim 1 .

15 . A substrate transferring unit for a sputtering device, comprising:

a supporting unit supporting a substrate;

a fixing unit fixing one side of the substrate to the supporting unit; and

a gas injection assembly on an upper surface of the supporting unit, the gas injection assembly forming a gas cushion between the substrate and the upper surface of the supporting unit.

16 . The substrate transferring unit of claim 15 , further comprising a roller for moving the substrate transferring unit.

17 . The substrate transferring unit of claim 16 , further comprising a gas flow amount controller and a gas injection nozzle, which includes a gas injection pipe for supplying a gas from the gas flow amount controller, an injection opening for injecting the supplied gas, a plurality of inlets arranged around the injection opening for sucking gas injected from the injection opening and circulating the gas, and a plurality gas exhaustion pipes.

18 . A liquid crystal device comprising a substrate including a thin film formed in the substrate transferring unit of claim 15.