Thin film transistor and method of fabricating the same
View Patent ↗A thin film transistor including a substrate having first and second regions, a semiconductor layer pattern formed in the first region and the second region, and a first gate insulating layer pattern formed on a channel region of the semiconductor layer pattern of the first region. A second gate insulating layer is formed on the substrate, a first conductive layer pattern is formed above the channel region of the first region and above the semiconductor layer pattern of the second region, and an inter-layer insulating layer is formed on the substrate. A second conductive layer pattern is formed in the first region and above the first conductive layer pattern of the second region. The second conductive layer pattern of the first region is coupled to the semiconductor layer pattern of the first region through the second gate insulating layer and the inter-layer insulating layer.
1. A thin film transistor, comprising:
a substrate having a first region and a second region;
a first semiconductor pattern formed in the first region and a second semiconductor pattern formed in the second region;
a first conductive pattern formed above a channel region of the first semiconductor pattern of the first region and a second conductive pattern formed above the second semiconductor pattern of the second region;
a third conductive pattern formed in the first region and a fourth conductive pattern formed above the second conductive pattern of the second region,
wherein a first gap between the first conductive pattern and the first semiconductor pattern of the first region is greater than a second gap between the second conductive pattern and the second semiconductor pattern of the second region, and wherein the first gap is formed by a first gate insulating pattern formed on the channel region and a first insulating layer formed on the substrate, and the second gap is formed by the first insulating layer,
wherein the first gate insulating pattern is arranged directly between the first semiconductor pattern and the first insulating layer,
wherein a width of the first gate insulating pattern is the same as a width of the channel region of the first region, and
wherein the first insulating layer directly contacts an upper surface and a side surface of the first gate insulating pattern.
2. The thin film transistor of claim 1 , wherein the first semiconductor pattern of the first region comprises the channel region, a source region, and a drain region, and the first conductive pattern does not overlap with either the source region or the drain region.
3. The thin film transistor of claim 1 , wherein the first semiconductor pattern of the first region comprises the channel region, a source region, and a drain region, and the first gate insulating pattern does not overlap with either the source region or the drain region.
4. The thin film transistor of claim 1 , wherein the first insulating layer contacts the first semiconductor pattern.