Substrate with patterned conductive layer

1. A method for processing a substrate, compnsing:

firing a multi-layer substrate, wherein the multi-layer substrate has a first surface, a second surface that opposes the first surface, and conductive paths extending from the first surface to the second surface;

after firing the multi-layer substrate, smoothing the first surface of the multi-layer substrate;

after smoothing the first surface, covering a portion of the first surface with a conductive material; and

removing a portion of the conductive material from the first surface to define conductive traces on the first surface.

2. The method of claim 1 , wherein the multi-layer substrate is a space transformer substrate.

3. The method of claim 2 , wherein removing the portion of the conductive material is performed using laser trimming.

4. The method of claim 2 , wherein covering the portion of the first surface includes covering the portion of the first surface with the conductive material in a layer at least 1.0 μm thick.

5. The method of claim 1 , further comprising:

applying an adhesive layer over the conductive material before removing the portion of the conductive material and

removing the adhesive layer, together with any debris adhering thereto, after removing the portion of the conductive material.

6. The method of claim 1 , wherein the multi-layer substrate is a a space transformer substrate, and removing the portion of the conductive material includes removing the portion of the conductive material to define the conductive traces between (1) conductive vias of the space transformer substrate and (2) respective predetermined locations of the conductive material configured to be probe pads.

7. The method of claim 6 , further comprising:

selecting a plurality of the conductive vias as fiducials; and

determining positions, by reference to the fiducials, for at least one of: the probe pads and the conductive traces.

8. The method of claim 1 , wherein the multi-layer substrate is a multi-layer ceramic substrate.

9. The method of claim 1 , further comprising:

predetermining at least one of a width and shape of the conductive traces such that an impedance of the conductive traces is substantially matched prior to removing the portion of the conductive material.

10. The method of claim 1 , wherein the portion of the conductive material is a first portion, and the method further comprises:

taking a remaining portion of the conductive material away from the first surface after removing the first portion of the conductive material:

covering a portion of the first surface with additional conductive material after taking the remaining portion of the conductive material away; and

removing a portion of the additional conductive material to define new conductive traces on the first surface.

11. A method for processing a space transformer comprising:

firing a multi-layer ceramic space transformer of a probe card, wherein the multi-layer ceramic space transformer has a first surface, a second surface that opposes the first surface, and conductive paths, formed by conductive vias, that extend from the first surface to the second surface;

after firing the multi-layer ceramic space transformer, smoothing the first surface of the multi-layer ceramic space transformer;

after smoothing the first surface, covering at least a portion of the surface with a conductive material such that the conductive vias are covered by the conductive material;

determining locations, on the conductive materials spaced to contact probes of the probe card; and

removing a portion of the conductive material to define conductive traces between the conductive vias and the locations, on the conductive material, spaced to contact probes of the probe card.

12. The method of claim 11 wherein removing the portion of the conductive material comprises laser trimming.

13. The method of claim 11 wherein covering at least the portion of the first surface of the multi-layer ceramic space transformer with the conductive material includes covering the portion of the first surface with the conductive material in a layer at least 10 μm thick.

14. The method of claim 11 , further comprising:

applying an adhesive layer over the conductive material before removing the portion of the conductive material to define conductive traces; and

removing the adhesive layer, together with any debris adhering thereto, after removing the portion of the conductive material to define conductive traces.

15. The method of claim 11 , further comprising:

selecting a plurality of the conductive vias as fiducials; and

determining positions, by reference to the fiducials, for at least one of(1) the locations, on the conductive material, spaced to contact probes of the probe card and (2) the conductive traces.

16. The method of claim 11 , further comprising:

predetermining at least one of a width and shape of the conductive traces such that an impedance of the conductive traces is substantially matched prior to removing the portion of the conductive material to define conductive traces.

17. The method of claim 11 , wherein the portion of the conductive material is a first portion, and the method further comprises:

taking a remaining portion of the conductive material away from the first surface after removing the first portion of the conductive material to define conductive traces;

covering, after taking the remaining portion of the conductive material away, a portion of the first surface with additional conductive material such that the conductive vias are covered by the additional conductive material; and

removing a portion of the additional conductive material to define new conductive traces between (a) the conductive vias and (b) predetermined locations on the additional conductive material.

18. A method for processing a substrate, comprising:

covering a portion of a first surface of a multi-layer substrate with a conductive material, wherein the multi-layer substrate has the first surface, a second surface that opposes the first surface, and conductive paths extending from the first surface to the second surface,

applying an adhesive layer over the conductive material;

after the adhesive layer has been applied to the conductive material, removing a portion of the conductive material to define conductive traces on the first surface; and

removing the adhesive layer, together with any debris adhering thereto, after removing the portion of the conductive material to define conductive traces on the first surface.

19. The method of claim 18 , wherein the multi-layer substrate is a space transformer substrate.

20. The method of claim 18 , wherein removing the portion of the conductive material to define conductive traces is performed using laser trimming.

21. The method of claim 18 , wherein covering the portion of the first surface of the multi-layer substrate with the conductive material includes covering the portion of the first surface with the conductive material in a layer at least 10 μm thick.

22. The method of claim 18 , wherein the multi-layer substrate is a space transformer substrate, and wherein removing the adhesive layer includes removing the portion of the conductive material to define the conductive traces between (1) conductive vias of the space transformer substrate and (2) respective predetermined locations of the conductive material configured to be probe pads.

23. The method of claim 22 , further comprising:

selecting a plurality of the conductive vias as fiducials; and

determining positions, by reference to the fiducials, for at least one of the probe pads and the conductive traces.

24. The method of claim 18 , wherein the multi-layer substrate is a multi-layer ceramic substrate.

25. The method of claim 18 , wherein the multi-layer substrate is a multi-layer ceramic substrate, and wherein the method further comprises:

prior to covering the portion of the first surface of the multi-layer ceramic substrate with a conductive material, but after firing the multi-layer ceramic substrate, smoothing the first surface of the multi-layer ceramic substrate.

26. The method of claim 18 , further comprising:

predetermining at least one of a width and shape of the conductive traces such that an impedance of the conductive traces is substantially matched prior to removing the adhesive layer.

27. The method of claim 18 , wherein the portion of the conductive material is a first portion, and the method further comprises:

taking a remaining portion of the conductive material away from the first surface after removing the first portion of the conductive material to define conductive traces on the first surface;

covering a portion of the first surface with additional conductive material after taking the remaining portion of the conductive material away from the first substrate; and

removing a portion of the additional conductive material to define new conductive traces on the first surface.

28. A method for processing a space transformer, comprising:

covering at least a portion of a first surface of a multi-layer ceramic space transformer with a conductive material such that conductive vias are covered by the conductive material, wherein the multi-layer ceramic space transformer has a first surface, a second surface that opposes the first surface, and conductive paths extending from the conductive vias adjacent the first surface to the second surface;

determining locations, on the conductive material, spaced to contact probes of the probe card;

applying an adhesive layer over a portion of the conductive material that covers the first surface;

removing a portion of the conductive material to define conductive traces between the conductive vias and the locations, on the conductive material, spaced to contact probes of the probe card;

after all conductive traces have been defined on the conductive material, removing the adhesive layer and any debris adhering thereto.

29. The method of claim 28 , wherein removing the portion of the conductive material to define conductive traces is performed using laser trimming.

30. The method of claim 28 , wherein covering at least a portion of the first surface of the multi-layer ceramic space transformer with the conductive material includes covering the portion of the first surface with the conductive material in a layer at least 10 μm thick.

31. The method of claim 28 , further comprising:

selecting a plurality of the conductive vias as fiducials; and

determining positions, by reference to the fiducials, for at least one of(1) the locations, on the conductive material, spaced to contact probes of the probe card and (2) the conductive traces.

32. The method of claim 28 , further comprising:

predetermining at least one of a width and shape of the conductive traces such that an impedance of the conductive traces is substantially matched prior to removing the portion of the conductive material.

33. The method of claim 28 , wherein the portion of the conductive material is a first portion, and the method further comprises:

taking a remaining portion of the conductive material away from the first surface after removing the first portion of the conductive material;

after taking the remaining portion of the conductive material away from the first surface, covering a portion of the first surface with additional conductive material such that the conductive vias are covered by the additional conductive material; and

removing a portion of the additional conductive material to define new conductive traces between the conductive vias and predetermined locations on the additional conductive material.