Hot-melt adhesive compositions
The invention provides hot-melt adhesive compositions comprising a) 5% to 99.995% by weight of a polyolefin of one or more C 3 -C 18 α-olefins and also, if desired, ethylene, b) 0.005% to 2% by weight of one or more nucleators, c) 0 to 50% by weight of tackifier resin, and d) 0 to 30% by weight of wax.
1 . A hot-melt adhesive composition comprising
a) 5% to 99.995% by weight of a polyolefin of one or more C 3 -C 18 α-olefins and optionally, ethylene,
b) 0.005% to 2% by weight of one or more nucleators,
c) 0 to 50% by weight of a tackifier resin, and
d) 0 to 30% by weight of a wax.
2 . The hot-melt adhesive composition as claimed in claim 1 , comprising
a) 5% to 94.995% by weight of a polyolefin of one or more C 3 -C 18 α-olefins and optionally ethylene,
b) 0.005% to 2% by weight of one or more nucleators,
c) 5% to 50% by weight of the tackifier resin, and
d) 0 to 20% by weight of the wax.
3 . The hot-melt adhesive composition as claimed in claim 1 , wherein the polyolefin has a ring & ball softening point of between 40 and 160° C., and a melt viscosity, measured at 170° C., of between 40 and 100 000 mPa.s.
4 . The hot-melt adhesive composition as claimed in claim 1 , wherein the polyolefin is composed of propylene units and ethylene units.
5 . The hot-melt adhesive composition as claimed in claim 1 , wherein the one or more nucleators used are compounds from the class of alkali metal, alkaline earth metal or aluminum salts of carboxylic acids or from the class of the bisbenzylidenesorbitans.
6 . The hot-melt adhesive composition as claimed in claim 1 , wherein one or more nucleators is a bisbenzylidenesorbitan.
7 . A method of targetedly shortening the open time of a hot-melt adhesive composition as claimed in claim 1 , comprising the step of controlling the shortening of the open time by altering the composition and concentration of the one or more nucleators.
8 . The hot-melt adhesive composition as claimed in claim 1 , wherein the polyolefin has a ring & ball softening point of between 80 and 140° C., and a melt viscosity, measured at 170° C., of between 40 60 and 50 000 mPa.s.
9 . An article comprising a first substrate and a second substrate, wherein the first substrate is bonded to the second substrate by the hot melt adhesive composition as claimed in claim 1.