Heat-activable and crosslinkable adhesive tape for bonding electronic components and conductor tracks

1. A method of bonding a material selected from the group consisting of plastic parts, electronic components, flexible printed circuits, combinations of electronic components and flexible printed circuits, and polyimide, said method comprising (A) providing a heat-activatable adhesive tape in the form of a sheet and unadhered to said material, thereafter (B) bonding said material with the heat-activatable adhesive tape to form an assembly and thereafter (C) heating the assembly to crosslink the heat-activatable adhesive, wherein the heat-activatable adhesive tape comprises an adhesive comprising the following components:

a) one or more acid-modified or acid-anhydride-modified vinylaromatic block copolymers having acid or acid-anhydride functional groups; and

b) one or more epoxidized vinylaromatic block copolymers having epoxide functional groups in an internal polymer block.

2. Method according to claim 1 , wherein the vinylaromatic block copolymers of components a) and/or b) are one or more styrene block copolymers.

3. Method according to claim 1 , wherein at least one of the block copolymers is hydrogenated in a soft block.

4. Method according to claim 1 , wherein the adhesive comprises tackifying resins, accelerators, dyes, carbon black and/or metal powders.

5. Method according to claim 1 , wherein the adhesive crosslinks at temperatures above 150° C.

6. Method according to claim 1 , wherein the adhesive comprises further elastomers based on pure hydrocarbons, elastomers which are saturated chemically and/or also chemically functionalized hydrocarbons.

7. Method according to claim 1 , which further comprises providing the heat-activatable adhesive tape in the form of a sheet and unadhered to said material by coating the adhesive onto a release layer.

8. Method according to claim 1 , wherein at least one of components a) and/or b) is composed of polyvinylaromatic-polyolefin block copolymers comprising terminal polyvinylaromatic homopolymer blocks and core polyolefin homopolymer blocks.

9. Method according to claim 8 , wherein the polyvinylaromatic homopolymer blocks are polystyrene blocks, and the polyolefin homopolymer blocks are poly-1,3-diene blocks.

10. Method according to claim 9 , wherein the poly-1,3-diene blocks are partly, selectively or fully hydrogenated.

11. Method according to claim 1 , wherein at least one of the one or more epoxidized vinylaromatic block copolymers is an epoxidized styrene-butadiene-styrene block copolymer.

12. Method according to claim 1 , wherein the heat-activatable adhesive tape is in the form of a roll.

13. Method according to claim 1 , wherein the heat-activatable adhesive tape consists of heat-activatable adhesive and optionally one or more release liners.

14. Method according to claim 1 , wherein the material is a flexible printed circuit board.