Transflective thin film transistor substrate of liquid crystal display device having a contact electrode connecting a data link to a data line

1. A method of fabricating a liquid crystal display device, comprising:

a first mask process forming a gate line, a storage line parallel to the gate line, a lower gate pad electrode, a lower data pad electrode and a data link on a substrate;

a second mask process forming a gate insulating film on the substrate on which the gate line, the storage line, the lower gate pad electrode, the lower data pad electrode and the data link are formed, and forming a semiconductor pattern on the gate insulating film, a data line crossing the gate line to define a pixel area including a transmission area and a reflection area, a source electrode and a drain electrode on the semiconductor pattern;

a third mask process forming an organic film on the data line, the source electrode and the drain electrode, and forming a drain contact hole passing through the organic film to expose the drain electrode, a transmission hole, a first contact hole, a second contact hole and a third contact hole passing through the organic film and the gate insulating film to expose the substrate, the lower gate pat electrode, the lower data pad electrode and the data link, respectively, and a fourth contact hole passing through the organic film to expose the data line;

a fourth mask process forming a pixel electrode on the organic film of the pixel area via the transmission hole, connected to the drain electrode, an upper gate pad electrode on the organic film to be connected with the lower gate pad electrode via the first contact hole, an upper data pad electrode on the organic film to be connected with the lower data pad electrode via the second contact hole, a first contact electrode on the organic film to be connected with the data link via the third contact hole and the data line via the fourth contact hole, wherein the pixel electrode is overlapped with the storage line; and

a fifth mask process forming a reflective electrode in the reflection area of the pixel area to expose the pixel electrode of the transmission hole, and a second contact electrode on the first contact electrode wherein the first contact electrode includes a transparent conductive film same as the pixel electrode, and the second contact electrode includes a reflective metal layer same as the reflective electrode; wherein the reflective metal layer entirely covers the transparent conductive film so that the transparent conductive film is unexposed.

2. The method according to claim 1 , wherein the second mask process further includes forming a storage capacitor including the storage line and the drain electrode, wherein the storage line overlaps with the drain electrode extended from the thin film transistor with the gate insulating film therebetween.

3. The method according to claim 1 , wherein the data link is extended from the lower data pad electrode to be connected to the data line.

4. The method according to claim 1 , wherein the first and second contact electrodes are in an area to be sealed by a sealant.

5. The method according to claim 1 , wherein the reflective electrode is connected to the pixel electrode and is formed to cover a side surface of the transmission hole.

6. The method according to claim 1 , wherein the edge part of the reflective electrode is formed to be at an outer side from the edge part of the pixel electrode.

7. The method according to claim 1 , wherein the reflective electrode overlaps with at least one of the gate line and the data line.

8. The method according to claim 1 , wherein the third mask process further includes forming a passivation film formed of an inorganic insulating material under the organic film.