Reduction of heat loss in micro-fluid ejection devices
View Patent ↗The present disclosure is directed to a micro-fluid ejection head for a micro-fluid ejection device. The head includes a semiconductor substrate, a fluid ejection actuator supported by the semiconductor substrate, a nozzle member containing nozzle holes attached to the substrate for expelling droplets of fluid from one or more nozzle holes in the nozzle member upon activation of the ejection actuator. The substrate further includes a thermal insulating barrier layer between the semiconductor substrate and the fluid ejection actuator. The thermal insulating barrier layer includes a porous, substantially impermeable material having a thermal conductivity of less than about 1 W/m-K.
1. A micro-fluid ejection head for a micro-fluid ejection device, the head comprising a semiconductor substrate, a first layer selected from the group consisting of a thermal oxide layer, a planarization layer, and a combination of thermal oxide layer and planarization layer adjacent to the semiconductor substrate, a fluid ejection actuator supported by the semiconductor substrate and first layer, a nozzle member containing nozzle holes attached to the substrate for expelling droplets of fluid from one or more nozzle holes in the nozzle member upon activation of the ejection actuator, wherein the substrate further comprises a thermal insulating barrier layer between the first layer and the fluid ejection actuator wherein the thermal insulating barrier layer comprises a porous, substantially impermeable material having a thermal conductivity of less than about 1 W/m-K.
2. The ejection head of claim 1 , wherein the porous, substantially impermeable material has a thickness ranging from about 3,000 to about 10,000 Angstroms.
3. The ejection head of claim 1 , wherein the first layer comprises a thermal oxide layer disposed on the semiconductor substrate between the porous, substantially impermeable material and the semiconductor substrate.
4. The ejection head of claim 1 , further comprising a thermal oxide layer disposed on the semiconductor substrate between the porous, substantially impermeable material the ejection actuator.
5. The ejection head of claim 1 , wherein the first layer comprises a planarization layer disposed on the semiconductor substrate between the porous, substantially impermeable material and the semiconductor substrate.
6. The ejection head of claim 1 , wherein the ejection head comprises a thermal inkjet print head.
7. The ejection head of claim 1 , further comprising a rigid support film disposed on the semiconductor substrate between the porous, substantially impermeable material and the ejection actuator.
8. A micro-fluid ejection structure for expelling droplets of fluid, said fluid ejection structure comprising:
a thermal fluid ejector actuator wherein said thermal fluid ejector actuator increases in temperature and vaporizes a volume of fluid in contact therewith when a voltage is applied to said thermal fluid ejection actuator;
a semiconductor substrate supporting said thermal fluid ejection actuator;
a first layer selected from the group consisting of a thermal oxide layer, a planarization layer, and a combination of thermal oxide layer and planarization layer adjacent to the semiconductor substrate, and
an insulating layer having a thermal conductivity of less than about 1 W/m-K disposed between the thermal fluid ejection actuator and the first layer.
9. The fluid ejection structure of claim 8 , wherein said insulating layer has a thickness ranging from about 3,000 to about 10,000 Angstroms.
10. The fluid ejection structure of claim 8 , wherein the first layer comprises a thermal oxide layer disposed between the insulating layer and the semiconductor substrate.
11. The fluid ejection structure of claim 8 , further comprising a thermal oxide layer disposed between the insulating layer and the fluid ejection actuator.
12. The fluid ejection structure of claim 8 , wherein the first layer comprises a planarization layer disposed between the insulating layer and the semiconductor substrate.
13. The fluid ejection structure of claim 8 , further comprising a rigid support film overlying the insulating layer between the insulating layer and the fluid ejection actuator.
14. A method for reducing energy consumption for a micro-fluid ejection head, comprising the steps of:
depositing a thermal insulating layer having a thermal conductivity of less than about 1 W/m-K onto a first layer selected from the group consisting of a thermal oxide layer, a planarization layer, and a combination of thermal oxide layer and planarization layer adjacent to a semiconductor support substrate; and
depositing a resistive layer on the semiconductor support substrate to provide a fluid ejector actuator, wherein the thermal insulating layer is disposed between the resistive layer and the first layer.
15. The method of claim 14 wherein the insulating layer is deposited with a thickness ranging from about 3,000 to about 10,000 Angstroms.
16. The method of claim 14 , wherein the first layer comprises a thermal oxide layer deposited on the support substrate between the insulating layer and the support substrate.
17. The method of claim 14 further comprising depositing a thermal oxide layer on the support substrate between the insulating layer and the resistive layer.
18. The method of claim 14 , wherein the first layer comprises a planarization layer deposited on the support substrate between the insulating layer and the support substrate.
19. The method of claim 14 , further comprising depositing a rigid support film on the support substrate between the insulating layer and the resistive layer.