IP Library Patent Application 11171571
Patent Application
App. No. 11/171,571

Apparatus for treating substrates

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Quick Facts
Patent No.
US None
App. No.
11/171,571
Abstract

An apparatus for treating substrate comprising, a moving mechanism for moving a substrate and a high pressure spray unit comprising a first high pressure spray having a first nozzle portion disposing transverse to the direction of movement of the substrate and a second high pressure spray having a second nozzle portion parallel to the first nozzle portion.

Claims (36)

1 . An apparatus for treating substrates, comprising:

a moving mechanism for moving a substrate; and

a high pressure spray unit comprising a first high pressure spray having a first nozzle portion disposed transverse to a direction of movement of the substrate and a second high pressure spray having a second nozzle portion parallel to the first nozzle portion.

2 . The apparatus for treating substrates according to claim 1 , wherein at least one of the first nozzle portion and the second nozzle portion directs fluid at an oblique angle to the surface of the substrate.

3 . The apparatus for treating substrates according to claim 1 , wherein a treating fluid from the first high pressure spray is applied to the substrate prior to supply of a treating fluid from the second high pressure spray, and the treating fluid from the first high pressure spray comprises air and the treating fluid from the second high pressure spray comprises water.

4 . The apparatus for treating substrates according to claim 1 , wherein a treating fluid from the first high pressure spray is applied to the substrate prior to application of a treating fluid from the second high pressure spray, and the treating fluid from the first high pressure spray comprises room-temperature air and the treating fluid from the second high pressure spray comprises heated air.

5 . The apparatus for treating substrates according to claim 1 , further comprising a widthwise high pressure spray having a widthwise nozzle portion disposed along the direction of movement of the substrate.

6 . An apparatus for treating substrates comprising:

a moving mechanism for moving a substrate; and

a widthwise high pressure spray having a widthwise nozzle portion disposed along a direction of movement of the substrate.

7 . The apparatus for treating substrates according to claim 6 , further comprising a lengthwise high pressure spray having a lengthwise nozzle portion disposed transverse to the direction of movement of the substrate.

8 . The apparatus for treating substrates according to claim 7 , wherein a treating fluid from the widthwise high pressure spray and the lengthwise high pressure spray comprises water.

9 . The apparatus for treating substrates according to claim 6 , wherein:

the moving mechanism supports the substrate at an inclined angle; and

the widthwise high pressure spray is disposed along an elevated edge of the substrate.

10 . An apparatus for treating substrates, comprising:

a moving mechanism for moving a substrate in a first direction; and

a washing module, comprising a first high pressure spray unit, said first high pressure spray unit comprising:

a first elongate spray nozzle extending across a length of the substrate transverse to the first direction; and

a second elongate spray nozzle extending across a width of the substrate parallel to the first direction.

11 . The apparatus of claim 10 , wherein the second elongate spray nozzle directs fluid at an oblique angle to the surface of the substrate.

12 . The apparatus of claim 10 , wherein:

the first elongate spray nozzle applies a compressed gas to an upper surface of the substrate; and

the second elongate spray nozzle applies water to the upper surface of the substrate.

13 . The apparatus of claim 10 , wherein:

the first elongate spray nozzle applies compressed room-temperature air to an upper surface of the substrate; and

the second elongate spray nozzle applies compressed heated air to the upper surface of the substrate.

14 . The apparatus of claim 10 , further comprising:

a widthwise high pressure spray comprising an elongate nozzle portion extending along the first direction.

15 . The apparatus of claim 14 , further comprising:

a lengthwise high pressure spray comprising an elongate nozzle portion disposed transverse to the first direction.

16 . The apparatus of claim 15 , wherein:

the widthwise high pressure spray and the lengthwise high pressure spray apply water to the substrate.

17 . The apparatus of claim 15 , wherein:

the moving mechanism supports the substrate at an inclined angle; and

the widthwise high pressure spray is disposed along an elevated edge of the substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029008/0389 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2005
From: LEE, YOUNG-SIK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 016717/0106 →