Method for manufacturing a perpendicular magnetic recording transducer

1. A method for manufacturing a perpendicular magnetic recording transducer comprising;

providing a perpendicular magnetic recording pole by a process that includes plating utilizing a frame having an interior frame edge;

forming a chemical mechanical planarization (CMP) uniformity structure around the perpendicular magnetic recording pole and after the perpendicular magnetic recording pole has been formed, the CMP uniformity structure having a height substantially equal to a desired pole height and an aperture therein, the aperture having an edge substantially aligned with the interior frame edge;

fabricating an insulator on at least the CMP uniformity structure; and

performing a CMP to remove a portion of the insulator, exposing a portion of the perpendicular magnetic recording pole and planarizing an exposed surface of the perpendicular magnetic recording transducer.

2. The method of claim 1 wherein providing further includes:

creating photoresist structure having an aperture therein;

plating a perpendicular magnetic recording pole layer; and

stripping the photoresist structure.

3. The method of claim 2 wherein providing further includes:

trimming the perpendicular magnetic recording pole layer to form the perpendicular magnetic recording pole; and

performing a field etch after trimming the perpendicular magnetic recording pole layer.

4. The method of claim 2 wherein the photoresist structure further has a frame size corresponding to the interior frame edge.

5. The method of claim 1 wherein providing further includes:

performing a field etch; and

trimming the perpendicular magnetic recording pole layer to form the perpendicular magnetic recording pole after the field etch is performed.

6. The method of claim 1 wherein forming further includes:

fabricating an insulating layer having the height, the insulating layer covering a portion of the perpendicular magnetic recording transducer including the perpendicular magnetic recording pole; and

providing a CMP marker layer having the aperture therein, the CMP marker layer being on the insulating layer, the aperture residing above the perpendicular magnetic recording pole.

7. The method of claim 6 wherein the CMP marker layer has a CMP removal rate less than an insulator CMP removal rate for the insulator for the CMP used in removing the insulator.

8. The method of claim 7 wherein the CMP marker layer is a metal.

9. The method of claim 6 wherein the aperture has a width of at least 0.5 micron.

10. The method of claim 9 wherein the width is between two microns and ten microns.

11. The method of claim 6 wherein a portion of the insulating layer resides on the perpendicular magnetic recording pole and wherein a portion of the insulator resides on the portion of the insulating layer.

12. The method of claim 1 wherein the perpendicular magnetic recording pole has a top, a bottom, and a side, the side having an angle with respect to a vertical direction that is acute and nonzero such that the top is wider than the bottom.

13. The method of claim 1 further comprising:

fabricating a write gap on the exposed surface above the perpendicular magnetic recording pole; and

making a shield on the write gap.

14. A method for manufacturing a perpendicular magnetic recording transducer comprising;

fabricating a seed layer;

creating a pattern having a pole aperture therein and using a frame having an interior frame edge;

plating a perpendicular magnetic recording pole within the pole aperture, the perpendicular magnetic recording pole having a thickness;

removing the pattern;

trimming the perpendicular magnetic recording pole;

forming a chemical mechanical planarization (CMP) uniformity structure around the perpendicular magnetic recording pole and after the perpendicular magnetic recording pole is formed, the CMP uniformity structure having a height substantially equal to a desired pole height, the CMP uniformity structure including a first portion of an insulating layer and a CMP marker layer on the first portion of the insulating layer, the CMP marker layer having an aperture therein, the aperture being above the perpendicular magnetic recording pole, a second portion of the insulating layer residing on the perpendicular magnetic recording pole, a third portion of the insulating layer being distinct from the second portion of the insulating layer and within the aperture, the aperture having an aperture edge corresponding to the interior frame edge;

fabricating an insulator on at least the CMP uniformity structure; and

performing a CMP to remove a portion of the insulator and at least the second portion of the insulating layer, exposing a portion of the perpendicular magnetic recording pole and planarizing an exposed surface of the perpendicular magnetic recording transducer.