Shaped lead assembly for optoelectronic devices
A shaped lead configuration for use with optoelectronic packages, such as optical subassemblies, is disclosed. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.
1 . An optical transceiver module, comprising:
a housing;
a printed circuit board at least partially received by the housing;
an optoelectronic package, comprising:
a header containing optoelectronic components; and
a plurality of conductive leads that are in operable communication with the optoelectronic components, each lead including:
a straight portion extending from a surface of the header;
an end portion oriented so as to be retained within one of a plurality of vias defined in the printed circuit board; and
a shaped portion defining at least one bend in a first plane.
2 . The optical transceiver module as defined in claim 1 , wherein the shaped portion is interposed between the straight and end portions.
3 . The optical transceiver module as defined in claim 1 , wherein the optoelectronic package is an optical subassembly.
4 . The optical transceiver module as defined in claim 1 , the end portions are linearly arranged for insertion into linearly arranged vias on the printed circuit board.
5 . The optical transceiver module as defined in claim 1 , wherein at least one of the leads includes a shaped portion having bends defined in a first and a second plane.
6 . The optical transceiver module as defined in claim 5 , wherein the first and second planes are orthogonal.
7 . The optical transceiver module as defined in claim 1 , wherein the optoelectronic component includes five leads.
8 . The optical transceiver module as defined in claim 1 , wherein the shaped portion of each lead provides stress relief for retaining the end portion of the lead within the via.
9 . A method for attaching an optoelectronic package to a printed circuit board, the method comprising:
shaping a plurality of leads that extend from the package such that each lead includes a first portion extending from the package surface, an end portion oriented for insertion into a corresponding via defined in a printed circuit board, and a shaped portion interposed between the first portion and the end portion, the shaped portion including at least one bend defined in a first plane;
receiving at least part of the shaped portion of each lead into a clip assembly that maintains the orientation of the end portion of each lead; and
inserting the end portion of each lead into a corresponding through-hole via defined in a first surface of the printed circuit board.
10 . The method for attaching as defined in claim 9 , further comprising:
soldering each lead inserted into the corresponding through-hole via such that a segment of the end portion extends beyond a second surface of the printed circuit board.
11 . The method for attaching as defined in claim 9 , wherein shaping the plurality is manually performed.
12 . The method for attaching as defined in claim 9 , wherein receiving at least part of the shaped portion further includes:
receiving at least part of the shaped portion of each lead into a base of the clip assembly; and
attaching a cap on the base to cover a portion of each lead.
13 . The method for attaching as defined in claim 9 , wherein receiving at least part of the shaped portion further includes:
receiving at least part of the shaped portion of each lead into the clip assembly such that the leads are electrically isolated from one another.
14 . An optical subassembly, comprising:
a header containing at least one optoelectronic component;
a plurality of conductive leads that are in operable communication with the at least one optoelectronic component, each lead including:
a straight portion extending from a surface of the header;
an end portion oriented so as to be received by a through-hole via defined in a printed circuit board; and
a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane; and
a clip assembly having a plurality of cavities that each receive a corresponding one of the leads such that the end portion of each lead extends from a surface of the clip.
15 . The optical subassembly as defined in claim 14 , wherein the clip assembly maintains the orientation of the end portion of each lead in engaging a corresponding via defined in a printed circuit board.
16 . The optical subassembly as defined in claim 15 , wherein the clip assembly is formed from a material that assists in controlling impedances of the leads.
17 . The optical subassembly as defined in claim 16 , wherein the clip assembly further comprises:
a base portion including the plurality of cavities; and
a cap that removably attaches to the base portion.
18 . The optical subassembly as defined in claim 17 , wherein the cap includes a tongue that covers a portion of at least some of the leads, and wherein the base portion includes at least one post that cooperates with at least one recess defined in the cap.
19 . The optical subassembly as defined in claim 18 , wherein the base portion of the clip assembly includes extended portions that provide spacing between the base portion and a surface of the printed circuit board proximate the vias such that a solder fillet may be formed on each via.
20 . The optical subassembly as defined in claim 19 , wherein the cavities include beveled surfaces to assist in receiving the leads.
21 . The optical subassembly as defined in claim 20 , wherein the leads are received by vias that are defined on a single surface of the printed circuit board.