Method of selling integrated circuit dies for multi-chip packages
View Patent ↗An integrated circuit has a plurality of bonding pads, at least one of which is adapted to be directly electrically connected to a bonding pad of another integrated circuit rather than to an external pin of a package that houses a semiconductor die on which the integrated circuit is fabricated. The integrated circuit is designed and offered for sale. Preferred scenarios include offering the integrated circuit for sale even before receiving an order for the semiconductor die or alternatively, only in response to receiving a first such order. Preferably the die is offered for sale as a standard item. The dies are either fabricated on demand or kept in inventory.
1. A method of doing business, comprising:
(a) designing an integrated circuit to be fabricated as a sole integrated circuit on a semiconductor die, said sole integrated circuit including a plurality of bonding pads, all of said bonding pads being adapted to be directly electrically connected, subsequent to a sale and delivery of said semiconductor die, to bonding pads of at least one other integrated circuit rather than to external pins of a package that houses a semiconductor die whereon said sole integrated circuit is fabricated; and
(b) offering at least one said semiconductor die for sale.
2. The method of claim 1 , wherein said at least one semiconductor die is offered for sale before receiving an order for said at least one semiconductor die.
3. The method of claim 1 , wherein said at least one semiconductor die is offered for sale only subsequent to receiving an order for said at least one semiconductor die.
4. The method of claim 3 , wherein said designing of said sole integrated circuit is effected by a party that places said order.
5. The method of claim 3 , wherein said designing of said sole integrated circuit is effected in response to said receiving of said order.
6. The method of claim 1 , wherein said at least one semiconductor die is offered for sale as a standard item.
7. The method of claim 1 , further comprising the step of:
(c) fabricating said at least one semiconductor die.
8. The method of claim 7 , wherein said at least one semiconductor die is fabricated upon receiving an order for said semiconductor die.
9. The method of claim 1 , further comprising the step of:
(c) fabricating a plurality of said semiconductor dies.
10. The method of step 9 , wherein said plurality of said semiconductor dies is fabricated upon receiving an order for said semiconductor dies.
11. The method of claim 9 , further comprising the step of
(d) maintaining an inventory of said semiconductor dies.
12. The method of claim 11 , wherein said plurality of said semiconductor dies is fabricated and said inventory is maintained before receiving an order for said semiconductor dies.
13. The method of claim 11 , wherein said semiconductor dies are fabricated on at least one wafer, and wherein said inventory is of said at least one wafer.
14. The method of claim 11 , wherein said inventory is of said semiconductor dies to be sold individually.
15. The method of claim 1 , wherein said sole integrated circuit is a processor.
16. The method of claim 1 , wherein said sole integrated circuit is a memory.
17. A method of doing business, comprising:
(a) designing a first integrated circuit to be fabricated as a sole integrated circuit on a semiconductor die, said first integrated circuit including a plurality of bonding pads, at least one of said bonding pads being adapted to be directly electrically connected, subsequent to a sale and delivery of said semiconductor die, to a bonding pad of another integrated circuit rather than to an external pin of a package that houses a semiconductor die whereon said first integrated circuit is fabricated; and
(b) offering at least one said semiconductor die for sale;
wherein said first integrated circuit is designed with reference to a second integrated circuit that includes a plurality of bonding pads adapted to be directly electrically connected to respective external pins of a package that houses a semiconductor die whereon said second integrated circuit is fabricated, said first and second integrated circuits being substantially identical in functionality, each said bonding pad of said first integrated circuit that is adapted to be directly electrically connected to a bonding pad of another integrated circuit corresponding to a respective at least one of said bonding pads of said second integrated circuit that are adapted to be directly electrically connected to respective said external pins.
18. The method of claim 17 , further comprising the steps of:
(c) fabricating a plurality of said first integrated circuits on a plurality of respective semiconductor dies; and
(d) fabricating a plurality of said second integrated circuits on a plurality of respective semiconductor dies.
19. The method of claim 18 , wherein said pluralities of said semiconductor dies are fabricated upon receiving an order for said semiconductor dies.
20. The method of claim 18 , further comprising the step of:
(e) maintaining, simultaneously, an inventory of said semiconductor dies whereon said first integrated circuits are fabricated and an inventory of said semiconductor dies whereon said second integrated circuits are fabricated.
21. The method of claim 20 , wherein said semiconductor dies are fabricated and wherein said inventories are maintained before receiving an order for said semiconductor dies whereon said first integrated circuits are fabricated.