Liquid crystal panel structure
A liquid crystal panel structure includes a liquid crystal panel, a plurality of first and second contact terminals, and a plurality of first and second peripheral wirings. The liquid crystal display has a display area and a non-display area. The non-display area has at least one driving chip lamination area. The first and second contact terminals are allocated in the lamination area of the driving chip. The first peripheral wirings are allocated on the non-display area, and the first contact terminals are electrically connected to the pixels of the display area. The liquid crystal panel can selectively provides allocation of two types of driving chips, such that the liquid crystal panel can be applied to single or dual display module.
1 . A liquid crystal panel structure, comprising:
a liquid crystal panel, including a display area and a non-display area, the display area comprising a plurality of pixels and the non-display area comprising at least one driving chip lamination area;
a plurality of first contact terminals allocated in the driving chip lamination area;
a plurality of second contact terminals allocated in the driving chip lamination area;
a plurality of first peripheral wirings allocated in the non-display area to electrically connected to the pixels of the display area; and
a plurality of second peripheral wirings allocated in the non-display area to electrically connect to the second contact terminals.
2 . The structure of claim 1 , further comprising a plurality of first contact pads allocated on the non-display area to electrically connect to the first and the second contact terminals.
3 . The structure of claim 1 , further comprising a plurality of second contact pads allocated on the non-display area to electrically connect the second peripheral wirings.
4 . The structure of claim 3 , further comprising a plurality of anti-corrosion metal lines each being allocated between one of the second peripheral wirings and one of the second contact pads, so as to electrically connect the second peripheral wiring and the second contact pad.
5 . The structure of claim 4 , wherein the anti-corrosion metal lines are fabricated from indium tin oxide.
6 . The structure of claim 4 , wherein the anti-corrosion metal lines serve as wiring to be cut.
7 . The structure of claim 1 , wherein a part of the first peripheral wirings and a part of the second peripheral wirings are formed in different layers.
8 . The structure of claim 7 , further comprising a resin frame allocated in the non-display area, and either the part of the first peripheral wirings or the part of the second peripheral wirings is formed under the resin frame.
9 . A dual display module, comprising:
a first liquid crystal panel, including a display area and a non-display area, the display area comprising a plurality of pixels and the non-display area comprising at least one driving chip lamination area;
a plurality of first contact terminals allocated in the driving chip lamination area;
plurality of second contact terminals allocated in the driving chip lamination area;
a plurality of first peripheral wirings allocated in the non-display area to electrically connected to the pixels of the display area;
a plurality of second peripheral wirings allocated in the non-display area to electrically connect to the second contact terminals;
a second liquid crystal panel, electrically connected to the second peripheral wirings; and
at least one driving chip allocated on the driving chip lamination area and electrically connected to the first and the second contact terminals to drive the first and the second liquid crystal panel.
10 . The module of claim 9 , further comprising a plurality of first contact pads allocated on the non-display area to electrically connect to the first and the second contact terminals, wherein the first contact pads are electrically connected to a control circuit board via a first soft circuit film.
11 . The module of claim 9 , further comprising a plurality of second contact pads allocated on the non-display area to electrically connect the second peripheral wirings, wherein the second contact pads are electrically connected to the second liquid crystal panel via a second soft circuit film.
12 . The module of claim 11 , further comprising a plurality of anti-corrosion metal lines each being allocated between one of the second peripheral wirings and one of the second contact pads, so as to electrically connect the second peripheral wiring and the second contact pad.
13 . The module of claim 12 , wherein the anti-corrosion metal lines are fabricated from indium tin oxide.
14 . The module of claim 12 , wherein the anti-corrosion metal lines serve as wiring to be cut.
15 . The module of claim 9 , wherein a part of the first peripheral wirings and a part of the second peripheral wirings are formed in different layers.
16 . The module of claim 15 , further comprising a resin frame allocated in the non-display area, and either the part of the first peripheral wirings or the part of the second peripheral wirings is formed under the resin frame.
17 . A dual display module, comprising:
a liquid crystal panel, including a display area and a non-display area, the display area comprising a plurality of pixels and the non-display area comprising at least one driving chip lamination area;
a plurality of first contact terminals allocated in the driving chip lamination area;
a plurality of second contact terminals allocated in the driving chip lamination area;
a plurality of first peripheral wirings allocated in the non-display area to electrically connected to the pixels of the display area;
a plurality of second peripheral wirings allocated in the non-display area to electrically connect to the second contact terminals; and
at least one driving chip allocated on the driving chip lamination area and electrically connected to the first and the second contact terminals to drive the liquid crystal panel.
18 . The module of claim 17 , further comprising a plurality of first contact pads allocated on the non-display area to electrically connect to the first and the second contact terminals, wherein the first contact pads are electrically connected to a control circuit board via a first soft circuit film.
19 . The module of claim 17 , wherein a part of the first peripheral wirings and a part of the second peripheral wirings are formed in different layers.
20 . The module of claim 19 , further comprising a resin frame allocated in the non-display area, and either the part of the first peripheral wirings or the part of the second peripheral wirings is formed under the resin frame.