Stacked module systems and methods
The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a form standard associated with one or more CSPs provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the contacts of the lower CSP will be compressed before flex circuitry is attached to a combination of the CSP and a form standard to create lower profile contacts between CSP and the flex circuitry.
1 - 20 . (canceled)
21 . A high-density circuit module comprising:
a first CSP having a planar surface rising from which are contacts, the contacts rising from the planar surface by a height D 1 ;
a second CSP disposed above the first CSP in stacked disposition;
a first form standard disposed, in substantial part, above the first CSP;
flex circuitry connecting the first and second CSPs;
at least one metallic bond attaching the flex circuitry and the first form standard; and
module contacts, the module contacts extending from the flex circuit by a height Dm, where Dm is greater than D 1 .
22 . The high-density circuit module of claim 21 further comprising a second form standard.
23 . The high-density circuit module of claim 22 in which the flex circuitry is comprised of a first flex circuit and a second flex circuit which are each attached to the first form standard with at least one metallic bond.
24 . The high-density circuit module of claim 21 in which the metallic bond comprises tin and gold.
25 . The high-density circuit module of claim 21 in which the metallic bond is created by combining a first metallic material applied to the first form standard and a second metallic material from which the flex circuitry is comprised.
26 . A high-density circuit module comprising:
a first CSP;
a second CSP stacked above the first CSP;
a first form standard associated with the first CSP;
a second form standard associated with the second CSP; and
flex circuitry connecting the first and second CSPs, the flex circuitry being attached to the first form standard and comprising at least two conductive layers.
27 . The high-density circuit module of claim 26 in which the attachment of the flex circuitry to the first form standard is with at least one metallic bond.
28 . The high-density module of claim 27 in which the at least one metallic bond is comprised of a first metallic material and a second metallic material wherein the first metallic material is comprised of tin.
29 . The high-density module of claim 27 in which the flex circuitry is comprised of a first flex circuit and a second flex circuit and each of the first and second flex circuits is attached to the first form standard with at least one metallic bond.
30 . The high-density module of claim 26 in which the flex circuitry is attached to the first form standard with adhesive.
31 . (canceled)