IP Library Granted Patent US 7,097,292
Granted Patent B2
US 7,097,292 · App. 11/176,307 · Granted Aug 29, 2006

Printhead assembly with printhead modules

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,097,292
App. No.
11/176,307
Granted
Aug 29, 2006
Kind
B2
Abstract

A printhead assembly includes an elongate ink reservoir arrangement that defines a plurality of ink reservoirs, particular inks being received in respective ink reservoirs. A plurality of printhead modules are releasably engaged with the ink supply. Each printhead module includes a plurality of ink chambers in fluid communication with respective ink reservoirs. A micro-electromechanical printhead chip is mounted on each respective printhead module and has inlets in fluid communication with the ink chambers.

Claims (14)

1. A printhead assembly that comprises:

an elongate ink reservoir arrangement that defines a plurality of ink reservoirs, particular inks being received in respective ink reservoirs;

a plurality of printhead modules releasably engaged with the ink supply, each printhead module including a plurality of ink chambers in fluid communication with respective ink reservoirs; and

a micro-electromechanical printhead integrated circuit mounted on each respective printhead module and having inlets in fluid communication with the ink chambers,

wherein the ink chambers are connected to respective ink reservoirs with flared mouths.

2. A printhead assembly as claimed in claim 1 , wherein a hydrophobic, sealing collar is positioned about each mouth.

3. A printhead assembly as claimed in claim 2 , wherein the ink reservoir arrangement includes a plurality of nozzles, each nozzle being configured sealingly to engage each respective collar.

4. A printhead assembly as claimed in claim 1 , wherein each printhead module and the ink reservoir arrangement include complementary snap fitting arrangements for facilitating snap fitting engagement of each module to the ink reservoir arrangement.

5. A printhead assembly as claimed in claim 1 , wherein each printhead module includes:

a cover molding;

a micromolding supported by the cover molding;

a Tape Automated Bond (TAB) layer which is supported by the micromolding: and

the printhead integrated circuit which is attached to the TAB layer to receive control and power signals from the TAB layer.

6. A printhead assembly as claimed in claim 1 , in which the printhead modules abut one another and are each askew with respect to the ink supply.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028548/0551 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2005
From: SILVERBROOK, KIA; KING, TOBIN ALLEN; JACKSON, GARRY RAYMOND
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 017258/0735 →