Mounting structure for electronic components
View Patent ↗A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step portion is formed by perforating a region on one surface of the circuit board, and then peeling a part of the circuit board corresponding to the perforated region so as to reduce the thickness of the circuit board at the region.
1. A mounting structure for electronic components, comprising:
a rigid-flex board comprising a thickness w 1 ;
an electronic component mounted on the rigid-flex board, the electronic component comprising a lead interval w 2 that is smaller than the thickness w 1 ,
wherein the rigid-flex board comprises a step portion formed at one end portion thereof, and
the step portion is sandwiched by a lead for transmitting electric signals of the electronic component so as to secure the lead to the step portion,
wherein:
the rigid-flex board comprises a flexible board;
the step portion comprises a flexible board exposed portion at which the flexible board is exposed.
2. The mounting structure according to claim 1 , wherein:
the lead is secured substantially linearly to the step portion.
3. The mounting structure according to claim 1 , wherein:
the step portion comprises a thickness w 3 , and
the thickness w 3 is smaller than the lead interval w 2 .
4. The mounting structure according to claim 1 , wherein:
the step portion is formed in part at the one end portion of the rigid-flex board.
5. The mounting structure according to claim 1 , wherein:
the step portion is formed by perforating a region on one surface of the rigid-flex board, and then peeling a part of the rigid-flex board corresponding to the perforated region so as to reduce the thickness of the rigid-flex board at the region.
6. An optical transceiver, comprising:
a mounting structure;
wherein the mounting structure comprises:
a rigid-flex board comprising a thickness w 1 ;
an electronic component mounted on the rigid-flex board, the electronic component comprising a lead interval w 2 that is smaller than the thickness w 1 ,
wherein the rigid-flex board comprises a step portion formed at one end portion thereof, and
the step portion is sandwiched by a lead for transmitting electric signals of the electronic component so as to secure the lead to the step portion,
wherein:
the rigid-flex board comprises a flexible board;
the step portion comprises a flexible board exposed portion at which the flexible board is exposed.
7. An optical transceiver, comprising:
a mounting structure;
wherein the mounting structure comprises:
a rigid flex board; and
an electronic component mounted on the rigid flex board;
wherein the rigid flex board comprises a concave portion formed at an end face thereof, and
the electronic component comprises a lead for transmitting electric signals, the lead being inserted and secured within the concave portion.