IP Library Granted Patent US 7,354,203
Granted Patent B2
US 7,354,203 · App. 11/178,624 · Granted Apr 8, 2008

Packages for devices and components

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Quick Facts
Patent No.
US 7,354,203
App. No.
11/178,624
Granted
Apr 8, 2008
Kind
B2
Abstract

A package for maintaining alignment of components includes a frame and a beam with the beam attached to the frame and one end of the beam. One or more components are mounted to the beam. The frame and a portion of the beam are separated from each other by a channel which allows portions of the beam to flex substantially independently of the frame when a force is applied to the frame. Thus, the effects resulting from forces applied to the frame are not experienced by the beam, or are at least attenuated, so that the alignment of the components mounted on the beam is substantially preserved.

Claims (23)

1. A package suitable for housing optical and electrical components, the package comprising:

a frame;

top and bottom lids that cooperate with the frame to substantially define an enclosure;

a beam disposed within the enclosure and attached to the frame in a cantilever arrangement; and

at least one component disposed on the beam, wherein the package defines an open space interposed between the frame and a substantial portion of the beam and a damping material is placed in the open space thereby attaching the frame to the beam.

2. The package as recited in claim 1 , wherein the beam is configured such that neither the beam nor the at least one component disposed thereon come into contact with the top and bottom lids.

3. The package as recited in claim 1 , wherein the beam is configured and arranged so that the beam and the at least one component are collectively in a substantially non-resonant condition over a predetermined range of package excitation frequencies.

4. The package as recited in claim 1 , wherein the damping material is an adhesive.

5. The package as recited in claim 1 , wherein the frame and the beam are comprised of the same material.

6. The package as recited in claim 5 , wherein the material is one of metal; plastic; glass; or, ceramic.

7. The package as recited in claim 1 , wherein the at least one component is configured to connect to a device located outside of the package through optical ports passing through the frame to the beam.

8. A package suitable for housing optical and electrical components, the package comprising:

a frame;

top and bottom lids that cooperate with the frame to substantially define an enclosure;

a plurality of beams disposed within the enclosure and attached to the frame in a cantilever arrangement; and

at least one optical component disposed on each of the plurality of beams, wherein the package defines an open space interposed between the frame and the plurality of beams and a damping material is placed in the open space thereby attaching the frame to the plurality of beams.

9. The package as recited in claim 8 , wherein the plurality of beams are configured such that neither the plurality of beams nor the at least one component disposed thereon come into contact with the top and bottom lids.

10. The package as recited in claim 8 , further comprising:

a damping material, wherein the damping material attaches the plurality of beams to the frame.

11. The package as recited in claim 8 , wherein the damping material is an adhesive.

12. The package as recited in claim 8 , wherein the frame and the plurality of beams are comprised of the same material.

13. The package as recited in claim 12 , wherein the material is one of: metal; plastic; glass; or, ceramic.

14. The package as recited in claim 8 , wherein the at least one component is configured to connect to a device located outside of the package through optical ports passing through the frame to the beam.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2005
From: PFNUER, STEFAN; DU, TENGDA; ZHANG, KEVIN; ENG, JULIE SHERIDAN; MEHNERT, AXEL
To: FINISAR CORPORATION
Reel/Frame 016391/0123 →