Single layer flex circuit

1. A flexible circuit comprising:

a first flexible substrate having a first end and a second end;

a second flexible substrate having a first end and a second end; and

a single conductive layer comprising a ground trace and a signal trace configured and arranged such that, in use the, ground trace and the signal trace are capacitively coupled to each other, the single conductive layer further configured and arranged such that substantially all of the single conductive layer is disposed between the first flexible substrate and the second flexible substrate, at least a portion of the conductive layer having a neutral bending axis.

2. The flexible circuit as recited in claim 1 , further comprising:

at least one via defined through the second end of the conductive layer and the second end of the second flexible substrate; and

at least one bonding pad located near the second end of the second flexible substrate and being in electrical communication with the conductive layer by way of the at least one via, wherein the at least one bonding pad is configured to be electrically connected to an external component.

3. The flexible circuit as recited in claim 1 , further comprising:

at least one via defined through the first end of the conductive layer and the first end of the second flexible substrate; and

at least one bonding pad located near the first end of the second flexible substrate, wherein the at least one bonding pad is placed in electrical communication with the conductive layer through the at least one via, wherein the at least one bonding pad is configured to be electrically connected to an optoelectronic package housing.

4. The flexible circuit as recited in claim 1 , wherein the bottom substrate and the first and second flexible substrates are composed of a dielectric material.

5. The flexible circuit as recited in claim 1 , wherein the first flexible substrate comprises a laminate material.

6. The flexible circuit as recited in claim 1 , wherein:

the flexible circuit as recited in claim 1 is incorporated into a module that comprises:

a printed circuit board; and

an optical subassembly connected to the printed circuit board by way of the flexible circuit of claim 1 .

7. The flexible circuit as recited in claim 6 , wherein the optical subassembly includes a ceramic feedthrough that is electrically connected to the printed circuit board by way of the flexible circuit of claim 1 .

8. The flexible circuit as recited in claim 6 , wherein the optical subassembly comprises to which the flexible circuit of claim 1 is connected comprises a receive optical subassembly (ROSA).

9. The flexible circuit as recited in claim 1 , wherein the signal trace includes a pad through which a via extends.

10. A flexible circuit comprising:

a first flexible substrate having a first end and a second end;

a second flexible substrate having a first end and a second end; and

a single conductive layer configured and arranged such that substantially all of the single conductive layer is disposed between the first flexible substrate and the second flexible substrate, at least a portion of the conductive layer having a neutral bending axis, and at least one hole defined in the first end of each of the first flexible substrate, the conductive layer, and the second flexible substrate, wherein the at least one hole is configured to receive a first lead of an optoelectronic package housing.

11. A flexible circuit comprising:

a top flexible substrate;

a bottom flexible substrate;

a signal trace disposed between the top flexible substrate and the bottom flexible substrate; and

a ground trace disposed between the top flexible substrate and the bottom flexible substrate, wherein a portion of the signal trace and a portion of the ground trace are disposed in the same plane, and the signal trace and ground trace being configured and arranged such that, in use, the ground trace and the signal trace are capacitively coupled to each other.

12. The flexible circuit as recited in claim 11 , wherein the bottom flexible substrate comprises a top surface and a bottom surface, the flexible circuit further comprising:

at least one via located in the bottom flexible substrate; and

at least one bonding pad located on the bottom surface of the bottom flexible substrate, wherein the at least one bonding pad is placed in electrical communication with the at least one signal trace through the at least one via.

13. The flexible circuit as recited in claim 11 , wherein the signal trace and the ground trace comprise substantially the same material.

14. The flexible circuit as recited in claim 11 , wherein one of the signal trace and the ground trace comprises copper.

15. The flexible circuit as recited in claim 11 , wherein a portion of the signal trace is located proximate a neutral axis of the flexible circuit.

16. The flexible circuit as recited in claim 11 , wherein a portion of the ground trace is located proximate a neutral axis of the flexible circuit.