IP Library Granted Patent US 7,510,390
Granted Patent B2
US 7,510,390 · App. 11/180,831 · Granted Mar 31, 2009

Machinable composite mold

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Quick Facts
Patent No.
US 7,510,390
App. No.
11/180,831
Granted
Mar 31, 2009
Kind
B2
Abstract

Machinable composite molds for use in making a composite structure. The mold includes a mold body having a tool surface that is shaped to provide the molded surface of the composite structure. The mold body is made up of at least one mold layer composed of a quasi-isotropic material composed of a plurality of randomly oriented fiber bundles or chips impregnated with a resin. The use of randomly oriented fiber chips allows post-cure machining of the mold body.

Claims (21)

1. A mold for use in making a composite structure wherein said composite structure has a molded surface, said mold comprising:

a mold body comprising a tool surface which is shaped to provide said molded surface of said composite structure, said mold body comprising at least one mold layer comprising a quasi-isotropic material comprising a plurality of randomly oriented rectangular chips comprising fibers and a resin, said mold layer comprising a surface that forms at least a part of said tool surface.

2. A mold for use in making a composite structure according to claim 1 wherein said resin comprises bismaleimide resin and said fibers comprise carbon fibers.

3. A mold for use in making a composite structure according to claim 1 wherein at least two mold layers are used to form said mold body.

4. A mold for use in making a composite structure according to claim 3 wherein said tool surface extends across at least a portion of two adjacent mold layers.

5. A mold for use in making a composite structure according to claim 1 wherein at least a portion of said tool surface is formed by machining at least a portion the surface of said mold layer.

6. A mold for use in making a composite structure according to claim 4 wherein at least a portion of said two adjacent mold layers are machined to provide said tool surface that extends across at least a portion of each of said adjacent mold layers.

7. A mold for use in making a composite structure according to claim 1 wherein said fibers comprise unidirectional fibers or woven fibers.

8. A mold for use in making a composite structure according to claim 2 wherein said fibers comprise unidirectional fibers or woven fibers.

9. A mold for use in making a composite structure according to claim 1 wherein said fibers comprise unidirectional fibers.

10. A mold for use in making a composite structure according to claim 2 wherein said fibers comprise unidirectional fibers.

11. A mold for use in making a composite structure according to claim 1 wherein said rectangular chips are from ½ inch to 4 inches long and from ⅛ inch to 1 inch wide.

12. A mold for use in making a composite structure according to claim 2 wherein said rectangular chips are from ½ inch to 4 inches long and from ⅛ inch to 1 inch wide.

13. A mold for use in making a composite structure according to claim 1 wherein said chip comprises from 1,000 to 100,000 fibers.

14. A mold for use in making a composite structure according to claim 2 wherein said chip comprises from 1,000 to 100,000 fibers.

15. A mold for use in making a composite structure according to claim 1 wherein said resin comprises from 30 to 50 volume percent of said chips.

16. A mold for use in making a composite structure according to claim 2 wherein said resin comprises from 30 to 50 volume percent of said chips.

17. A mold for use in making a composite structure according to claim 5 wherein said portion of said tool surface that is formed by machining has a surface contour deviation of less than ±0.003 inch.

18. A mold for use in making a composite structure according to claim 6 wherein said portion of said tool surface that is formed by machining has a surface contour deviation of less than ±0.003 inch.

19. A mold for use in making a composite structure according to claim 17 wherein said resin comprises bismaleimide resin and said fibers comprise carbon fibers.

20. A mold for use in making a composite structure according to claim 18 wherein said resin comprises bismaleimide resin and said fibers comprise carbon fibers.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Oct 2, 2014
From: CITIZENS BANK, NATIONAL ASSOCIATION
To: HEXCEL CORPORATION; HEXCEL HOLDINGS LUXEMBOURG S.À.R.L.
Reel/Frame 033887/0199 →
TERMINATION OF SECURITY INTEREST IN PATENTS Recorded Sep 24, 2014
From: CITIZENS BANK, NATIONAL ASSOCIATION (F/K/A RBS CITIZENS, N.A.)
To: HEXCEL CORPORATION
Reel/Frame 033813/0565 →
RELEASE OF SECURITY INTEREST Recorded Sep 3, 2013
From: BANK OF AMERICA, N.A.
To: HEXCEL CORPORATION
Reel/Frame 031140/0729 →
SECURITY AGREEMENT Recorded Jul 1, 2013
From: HEXCEL CORPORATION; HEXCEL HOLDINGS LUXEMBOURG S.A.R.L.
To: RBS CITIZENS, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 030724/0287 →
RELEASE OF SECURITY INTEREST Recorded Aug 20, 2010
From: DEUTSCHE BANK TRUST COMPANY AMERICAS
To: HEXCEL CORPORATION
Reel/Frame 024864/0040 →
SECURITY AGREEMENT Recorded Aug 20, 2010
From: HEXCEL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 024864/0016 →
GRANT OF PATENT SECURITY INTEREST Recorded May 21, 2009
From: HEXCEL CORPORATION
To: DEUTSCHE BANK TRUST COMPANY AMERICAS, AS ADMINISTRATIVE AGENT
Reel/Frame 022722/0240 →
RELEASE OF PATENT SECURITY INTEREST Recorded May 21, 2009
From: DEUTSCHE BANK TRUST COMPANY AMERICAS, AS ADMINISTRATIVE AGENT
To: HEXCEL CORPORATION; HEXCEL REINFORCEMENTS CORP.
Reel/Frame 022722/0301 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2005
From: CALLIS, RICHARD A.
To: HEXCEL CORPORATION
Reel/Frame 016834/0294 →
GRANT OF PATENT SECURITY INTEREST (IP SUPPLEMENT NO. 2) Recorded Oct 18, 2005
From: HEXCEL CORPORATION
To: DEUTSCHE BANK TRUST COMPANY AMERICAS, AS ADMINISTRATIVE AGENT
Reel/Frame 016653/0165 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2005
From: CALLIS, RICHARD A.
To: HEXCEL CORPORATION
Reel/Frame 016880/0289 →