Adhering layers to metals with dielectric adhesive layers
View Patent ↗The present invention provides a method for adhering dielectric layers to metals, in particular inert metals, using an adhesive layer comprising silicon-rich silicon nitride. Good adhesion is achieved at temperatures of less than 300° C., thereby facilitating the fabrication of semiconductor structures containing II-VI and III-V semiconductors.
1. A method of manufacturing a semiconductor structure, comprising:
depositing a metal layer over a semiconductor substrate;
depositing an adhesive layer of silicon-rich silicon nitride on said metal layer; and
depositing a dielectric layer, having a lower stoichiometric silicon content than said adhesive layer, on said adhesive layer, wherein said metal layer is a plate in a capacitor, and wherein said adhesive layer has a refractive index of between about 2.3 and about 2.7 at a wavelength of about 632 nm and said adhesive layer comprises a dielectric material having a stoichiometric ratio of silicon to nitrogen of between about 1.2 and about 1.5.
2. The method as recited in claim 1 , wherein said adhesive layer comprises a silicon nitride having a stoichiometric ratio of silicon to nitrogen of greater than about 1.
3. The method as recited in claim 1 , wherein depositing said adhesive layer is performed at a temperature of about 200° C. or less.
4. The method as recited in claim 1 , wherein said depositing of said adhesive layer is performed at a temperature of about 90° C. or less.
5. The method as recited in claim 1 , wherein said dielectric layer comprises a compound selected from the group consisting of:
silicon nitride; and
silica glass.
6. The method as recited in claim 1 , wherein said metal is an inert metal selected from the group of noble metals consisting of:
gold;
palladium; and
platinum.
7. The method as recited in claim 1 , wherein said semiconductor substrate comprises elements from Groups II and IV or from Groups III and V of the Periodic Table of Elements.
8. The method as recited in claim 1 , further including depositing a second metal layer over said dielectric layer, wherein a second silicon-rich silicon nitride adhesive layer is located between said second metal layer and said dielectric layer, and said second metal layer is a second plate of said capacitor.
9. The method as recited in claim 1 , wherein said adhesive layer of silicon rich silicon nitride has a ratio of silicon to nitrogen that does not exceed about 2:1.
10. A method of manufacturing a semiconductor structure, comprising:
depositing a metal layer over a semiconductor substrate;
depositing an adhesive layer of silicon-rich silicon nitride on said metal layer; and
depositing a dielectric layer, having a lower stoichiometric silicon content than said adhesive layer, on said adhesive layer, wherein said metal layer is a plate in a capacitor, and wherein
said adhesive layer has a refractive index of between about 2.3 and about 2.7 at a wavelength of about 632 nm, and
said adhesive layer is a metallic adhesive layer comprises said silicon-rich silicon nitride and transition metals.
11. The method as recited in claim 10 , wherein said transition metals comprise titanium, palladium, tungsten, chromium or mixtures thereof.