IP Library Granted Patent US 7,207,657
Granted Patent B2
US 7,207,657 · App. 11/185,720 · Granted Apr 24, 2007

Ink jet printhead nozzle arrangement with actuated nozzle chamber closure

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Quick Facts
Patent No.
US 7,207,657
App. No.
11/185,720
Granted
Apr 24, 2007
Kind
B2
Abstract

A nozzle arrangement for an ink jet printhead chip comprises a wafer substrate having a front surface, a rear surface and a nozzle chamber extending through the wafer substrate to define an inlet at the rear surface of the wafer substrate. An outlet is defined at the front surface of the wafer substrate. The nozzle chamber is in fluid communication with an ink supply at the rear surface of the wafer substrate. A closure member is positioned on the rear surface of the substrate and is displaceable between open and closed positions to control a flow of ink through the wafer substrate. An actuator is operatively engaged with the closure member to displace the closure member between the open and closed positions when activated.

Claims (10)

1. A nozzle arrangement for an ink jet printhead chip, the nozzle arrangement comprising

a wafer substrate having a front surface, a rear surface and a nozzle chamber extending through the wafer substrate to define an inlet at the rear surface of the wafer substrate and an outlet at the front surface of the wafer substrate, the nozzle chamber being in fluid communication with an ink supply at the rear surface of the wafer substrate;

a closure member positioned on the rear surface of the substrate and being displaceable between open and closed positions to control a flow of ink through the wafer substrate; and

an actuator operatively engaged with the closure member to displace the closure member between the open and closed positions, when activated; wherein,

the chamber, the outlet and the actuator are dimensioned with respect to the ink properties such that the ink is retained within the chamber when the closure member is in the closed position by the ink surface across the outlet.

2. A nozzle arrangement as claimed in claim 1 , in which the rear surface is substantially planar and the closure member is constrained to move in a plane substantially parallel to the rear surface.

3. A nozzle arrangement as claimed in claim 2 , in which the closure member is constrained to move between the open and closed positions along a linear path.

4. A nozzle arrangement as claimed in claim 1 , wherein the actuator engages the closure member via a gear train.

5. A nozzle arrangement as claimed in claim 4 , wherein the gear train includes at least one rotating gear wheel and a linear gear positioned on the closure member.

6. A nozzle arrangement as claimed in claim 1 , in which a drive circuitry layer is positioned on the rear surface of the wafer substrate and is electrically connected to the actuator, so tat the actuator can be activated by a signal received from the drive circuitry layer.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028551/0297 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2006
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 017168/0777 →