IP Library Granted Patent US 7,286,736
Granted Patent B2
US 7,286,736 · App. 11/187,264 · Granted Oct 23, 2007

Z-axis alignment of an optoelectronic component using a composite adhesive

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Quick Facts
Patent No.
US 7,286,736
App. No.
11/187,264
Granted
Oct 23, 2007
Kind
B2
Abstract

An optoelectronic device that employs a composite adhesive to properly position optical components within the device is disclosed. In one embodiment, an optical subassembly is disclosed, comprising a package housing, an optical component, and a composite adhesive that at least indirectly maintains the optical component in a predetermined position on a mounting surface within the package housing. The composite adhesive includes an adhesive substance, and a plurality of spacing elements intermixed in the adhesive substance, wherein the spacing elements at least indirectly space the optical component from a designated surface of the package housing such that the component is positioned in the predetermined position.

Claims (15)

1. An optical subassembly, comprising:

a package housing;

an optical component having a bottom defining a plane; and

a composite adhesive that at least indirectly maintains the optical component in a predetermined position on a mounting surface within the package housing, the predetermined position relating to z-axis positions along the direction of light propagation to the optical component or direction of light reception by the optical component, wherein the mounting surface and the plane defined by the bottom of the optical component are substantially parallel, wherein the composite adhesive includes:

an adhesive substance; and

a plurality of spacing elements intermixed in the adhesive substance, wherein the spacing elements at least indirectly space the optical component from a designated surface of the package housing such that the component is positioned in the predetermined position.

2. The optical subassembly as defined in claim 1 , wherein the optical subassembly further includes a lens, and wherein the predetermined position is determined with respect to a surface of the lens.

3. The optical subassembly as defined in claim 1 , wherein the spacing elements are spherically shaped.

4. The optical subassembly as defined in claim 3 , wherein the spherical spacing elements each have a uniform diameter, the diameter corresponding with the distance between the designated surface of the package housing and the predetermined position.

5. The optical subassembly as defined in claim 4 , wherein the designated surface is the mounting surface.

6. The optical subassembly as defined in claim 1 , wherein the composite adhesive is applied to the mounting surface such that a single layer of spacing elements are interposed between the optical component and the mounting surface.

7. The optical subassembly as defined in claim 1 , wherein the mounting surface for the optical component is defined on a submount of the package.

8. The optical subassembly as defined in claim 7 , wherein the composite adhesive is interposed between the optical component and the submount.

9. The optical subassembly as defined in claim 7 , wherein the composite adhesive is interposed between the submount and the designated surface of the package.

10. The optical subassembly as defined in claim 1 , wherein the adhesive substance is selected from the group consisting of epoxy, acrylic, solder, and adhesive film.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2005
From: ROSENBERG, PAUL K.
To: FINISAR CORPORATION
Reel/Frame 016628/0165 →