IP Library Granted Patent US 7,654,752
Granted Patent B2
US 7,654,752 · App. 11/187,333 · Granted Feb 2, 2010

Z-axis alignment of an optoelectronic component using a composite adhesive

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Quick Facts
Patent No.
US 7,654,752
App. No.
11/187,333
Granted
Feb 2, 2010
Kind
B2
Abstract

An optoelectronic package that employs a spacer tool system to properly align an optical component within the device is disclosed. In one embodiment, the package includes a mounting surface, and an optical component positioned on the mounting surface at a predetermined distance from a reference point. The optical component is positioned at the predetermined distance by a spacer tool, wherein the spacer tool is interposed between the optical component and a spacer tool mount during optical component positioning. The spacer tool is of a length that corresponds with the predetermined distance between the optical component and the reference point.

Claims (14)

1. An optical subassembly, comprising:

a package that defines a mounting surface; and

an optoelectronic component attached to the mounting surface with adhesive and including either an emitting or reception surface located at a predetermined z-axis distance from a reference point, the predetermined z-axis distance being substantially equal to an overall length of an associated spacer tool that is not a permanent element of the optical subassembly, and a thickness of the adhesive being a distance from the mounting surface to the reference point reduced by the predetermined z-axis distance and a thickness of the optoelectronic component.

2. The optical subassembly as defined in claim 1 , wherein the package includes a first package portion and a second package portion, a lens being attached to the first package portion, and the second package portion defining the mounting surface to which the optoelectronic device is attached, the optoelectronic device being arranged for optical communication with the lens.

3. The optical subassembly as defined in claim 1 , wherein the adhesive is selected from the group consisting of glue, solder, and adhesive strips.

4. The optical subassembly as defined in claim 1 , wherein a lens is included in the package, the lens being arranged for optical communication with the optoelectronic device, and wherein the predetermined z-axis distance is based upon a distance extending from the lens to the reference point.

5. The optical subassembly as defined in claim 1 , wherein the mounting surface for the optoelectronic component is defined on a submount of the package.

6. The optical subassembly as defined in claim 1 , wherein the package includes a first package portion and a second package portion, and wherein the reference point is defined at a mating interface of the first and second package portions.

7. The optical subassembly as defined in claim 6 , wherein one of the package portions defines the mounting surface.

8. The optical subassembly as defined in claim 1 , wherein the predetermined z-axis distance is dependent on characteristics of the particular package.

9. The optical subassembly as defined in claim 1 , wherein the optical subassembly comprises a ROSA.

10. The optical subassembly as defined in claim 1 , wherein the optical subassembly comprises a TOSA.

11. The optical subassembly as defined in claim 1 , wherein the optoelectronic component comprises an optical transmitter.

12. The optical subassembly as defined in claim 1 , wherein the optoelectronic component comprises an optical receiver.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2005
From: ROSENBERG, PAUL K.
To: FINISAR CORPORATION
Reel/Frame 016896/0125 →