Package sealing means and photonic device packages so formed
View Patent ↗The present invention is directed to hermetically sealed photonic device packages and the polymeric sealing means employed therefore for connecting one or more optical fibers to a photonic device.
1. A sealing means for connecting one or more optical fibers to a photonic device, said means comprising
a shaped article comprising at least 80% of one or more liquid crystalline polymers; said shaped article having an outer surface;
one or more optical fibers disposed to pass through said shaped article, said optical fibers being molded into place within said shaped article;
said shaped article being of a shape to permit coupling with its complementary counterpart on the housing of a photonic device wherein said liquid crystalline polymers consists essentially of a diol moiety, a diacid moiety, and a hydroxyacid moiety wherein the diol moiety consists essentially of 100 molar parts of hydroquinone and bisphenol at a mole ratio of 50-100:50-0, the diacid moiety consists essentially of 100 molar parts of terephthalic acid and 2,6 naphthalene dicarboxylic acid at a mole ratio of 70-30:30-70, and the hydroxyacid consists essentially of 150-320 molar parts of hydroxybenzoic acid.
2. A hermetically sealed optical signal processor comprising
a photonic device having a housing provided with a first sealing means;
one or more optical fibers optically coupled to said photonic device, and a second sealing means comprising
a shaped article comprising at least 80% of one or more liquid crystalline polymers; and,
said optical fibers disposed to pass through said shaped article, said optical fibers being molded into place within said shaped article;
wherein said first and second sealing means are complementary counterparts to one another and said first and second sealing means are hermetically sealed to one another.
3. The hermetically sealed optical signal processor of claim 2 wherein said photonic device further comprises an optical waveguide disposed upon a substrate.
4. The hermetically sealed optical signal processor of claim 3 wherein said photonic device further comprises one or more optical signal processing components selected from the group consisting of arrayed waveguide gratings, Bragg gratings, couplers, circulators, wavelength division multiplexers and demultiplexers, Y-branch thermo-optic switches, and switch arrays.
5. The hermetically sealed optical signal processor of claim 3 wherein said optical waveguide comprises silica.
6. The hermetically sealed optical signal processor of claim 3 wherein said optical waveguide comprises organic polymer.
7. The hermetically sealed optical signal processor of claim 2 wherein said hermetic seal comprises metal.
8. The hermetically sealed optical signal processor of claim 2 wherein said hermetic seal comprises organic adhesive.
9. The hermetically sealed optical signal processor of claim 2 wherein said hermetic seal comprises liquid crystalline polymer.
10. The hermetically sealed optical signal processor of claim 7 wherein said metal comprises gold or platinum.
11. The hermetically sealed optical signal processor of claim 2 wherein said liquid crystalline polymer consists essentially of a diol moiety, a diacid moiety, and a hydroxyacid moiety wherein the diol moiety consists essentially of 100 molar parts of hydroquinone and bisphenol at a mole ratio of 50-100:50-0, the diacid moiety consists essentially of 100 molar parts of terephthalic acid and 2,6 naphthalene dicarboxylic acid at a mole ratio of 70-30:30-70, and the hydroxyacid consists essentially of 150-320 molar parts of hydroxybenzoic acid.