Modular design method and apparatus
View Patent ↗Disclosed is a procedure or design approach for functional modules that may be used in connection with a multiprocessor integrated circuit chip. The approach includes keeping the dimensions of each module substantially the same and having the bus, power, clock and I/O connection configured the same on all modules. Further requirements for ease of use are to generalize the capability of each module as much as possible and to decentralize functions such as testing to be primarily performed within each module. The use of such considerations or rules substantially eases the design of a given type of custom chips, and based upon an initial chip design greatly facilitates the design of further custom chips, similar in application, but subsequent to the successful completion of the initial chip. The standardization modules and replication of the modules on a given chip also reduces physical verification time in initial chip design as well as redesign time of the initial chip when requirements for chip capability are redefined or otherwise changed. Any subsequent or further custom chips can include more or less of specific modules based upon already established parameters.
1. A method for providing a variable and scalable modular multiprocessor design for providing custom designed chips while avoiding redesign of modules comprising the design, said method comprising:
generating a multiprocessor chip design comprised of one or more processing unit (PU) modules and a plurality of assisting processing unit (APU) modules wherein said one or more PU modules control said APU modules and wherein said one or more PU modules and APU modules are designed in accordance with one or more rules establishing common parameters wherein at least one dimension of said one or more PU modules and APU modules is defined in said rules as a standard;
selecting said one or more PU modules and APU modules to be removed and/or added from said multiprocessor chip design; and
configuring said multiprocessor chip design comprised of said selected one or more PU modules and APU modules and a clock and power mesh positioned on each of said one or more PU modules and said APU modules wherein said design further comprises locating module bus connections in a same relative position for each of said one or more PU modules and APU modules requiring bus connections and a performance monitor bus connected to each of said one or more PU modules and APU modules.
2. The method of claim 1 , wherein said design further comprises a first plurality of DMA control modules, each associated with a different one of said first plurality of assisting processing modules.
3. The method of claim 1 , wherein examples of said common parameters include module dimensions, signal and power connections utilized, generalized module functionality and signal and power connection configurations.
4. The method of claim 1 wherein the step of generating a second multiprocessor design further comprises inserting said assisting processing modules to achieve a given processor functionality.
5. The method of claim 1 further her comprising using replications of the standardized assisting processing modules whereby the checking of a given module for compliance with predefined rules minimizes requirements for physical verification of other modules of the same functionality.
6. A computer program product for providing a variable and scalable modular multiprocessor design for providing custom designed chips while avoiding redesign of modules comprising the design, the computer program product having a computer program embodied in a storage device, the computer program, when executed by a computer, performing a method comprising
computer code for generating a multiprocessor chip design comprised of one or more processing unit (PU) modules and a plurality of assisting processing unit (APU) modules wherein said one or more PU modules control said APU modules and wherein said one ore more PU modules and APU modules are designed in accordance with one or more rules establishing common parameters wherein at least one dimension of said one or more PU modules and APU modules is defined in said rules as a standard;
computer code for preselecting a number of said modules selecting said one or more PU modules and APU modules to be removed and/or added from said first designs multiprocessor chip design; and
computer code for configuring said multiprocessor chip design comprised of said selected one or more PU modules and APU modules and a clock and power mesh positioned on each of said one or more PU modules and said APU modules wherein said design further comprises locating module bus connections in a same relative position for each of said one or more PU modules and APU modules requiring bus connections and a performance monitor bus connected to each of said one or more PU modules and APU modules.
7. The computer program product of claim 6 , wherein said design further comprises a first plurality of DMA control modules, each associated with a different one of said first plurality of assisting processing modules.
8. The computer program product of claim 6 further comprising computer code for using replications of the standardized assisting processing modules whereby the checking of a given module for compliance with predefined rules minimizes requirements for physical verification of other modules of the same functionality.