IP Library Granted Patent US 7,488,423
Granted Patent B2
US 7,488,423 · App. 11/195,108 · Granted Feb 10, 2009

System and method of slurry treatment

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Quick Facts
Patent No.
US 7,488,423
App. No.
11/195,108
Granted
Feb 10, 2009
Kind
B2
Abstract

Wastewater streams from semiconductor processing operations are treated to reduce the concentration therein of one or more metal species to a satisfactory level. The disclosed systems and technique utilize complexing ion exchange media to treat the wastewater streams having a significant concentration of oxidizing species.

Claims (47)

1. A method of treating a slurry stream comprising:

providing the slurry stream comprising at least one metal and at least one oxidizer present at a concentration of at least about 50 mg/L; and

introducing the slurry stream into an ion exchange column.

2. The method of claim 1 , wherein the ion exchange column comprises ion exchange material comprising at least one complexing group.

3. The method of claim 1 , wherein the ion exchange column comprises ion exchange material comprising at least one pendant functionality selected from the group consisting of iminodiacetate, polyamine, bispicolylamine, and aminophosphonic.

4. The method of claim 2 , wherein the ion exchange material comprises an iminodiacetate functional group.

5. The method of claim 1 , wherein the oxidizer concentration is less than about 1,500 mg/L.

6. The method of claim 5 , wherein the at least one oxidizer comprises at least one species selected from the group consisting of iodates, periodates, bromates, perbromates, chlorates, perchlorates, peroxygen compounds, nitrate compounds, persulfate compounds, permanganate compounds, and chromate compounds.

7. The method of claim 6 , wherein the at least one oxidizer comprises at least one compound selected from the group consisting of nitric acid, hydrogen peroxide, ferric nitrate, and ammonium persulfate.

8. The method of claim 7 , wherein the at least one metal comprises a metal selected from the group consisting of copper, lead, nickel, zinc, cobalt, cadmium, iron, tantalum, silver, gold, platinum, palladium, iridium, rhodium, ruthenium, gallium, manganese, tungsten, hafnium, and mixtures thereof.

9. The method of claim 8 , wherein the at least one metal is copper.

10. The method of claim 9 , wherein the slurry stream comprises particulate material having a diameter in a range of about 0.001 μm to about 1 μm.

11. The method of claim 10 , wherein the concentration of the particulate material in the slurry stream is in a range of about 50 mg/L to about 20,000 mg/L.

12. The method of claim 1 , wherein no pre-treatment to remove the at least one oxidizer in a carbon column is performed before performing the step of introducing the slurry stream into the ion exchange column.

13. The method of claim 1 , further comprising a step of neutralizing at least a portion of the at least one oxidizer.

14. The method of claim 13 , wherein the step of neutralizing comprises adding at least one reducing species to the slurry stream.

15. The method of claim 13 , wherein the step of neutralizing comprises chemically, electrochemically, photochemically, or thermochemically rendering at least a portion of the at least one oxidizer inactive.

16. A method of treating a chemical mechanical polishing slurry stream comprising introducing the slurry stream into a treatment system consisting essentially of at least one ion exchange unit comprising a chelating ion exchange resin.

17. The method of claim 16 , wherein the chelating ion exchange resin comprises an iminodiacetic functional group.

18. The method of claim 17 , wherein the slurry stream comprises solids having a diameter in a range of about 0.001 μm to about 1 μm.

19. The method of claim 18 , further comprising introducing the slurry stream to a pre-treatment system that chemically, electrochemically, photochemically, or thermochemically neutralizes at least a portion of any oxidizing species in the slurry stream, prior to performing the step of introducing the slurry stream into the treatment system.

20. A method for fabricating an electronic component comprising:

chemical mechanical polishing the electronic component with a slurry; and

introducing at least a portion of the slurry to a treatment system consisting essentially of an ion exchange column comprising ion exchange material comprising an iminodiacetate functional group.

21. The method of claim 20 , wherein the slurry comprises at least one oxidizing agent at a concentration of at least about 50 mg/L.

22. The method of claim 21 wherein the slurry comprises at least one metal species selected from the group consisting of copper, lead, nickel, zinc, cobalt, cadmium, iron, tantalum, silver, gold, platinum, palladium, iridium, rhodium, ruthenium, gallium, hafnium, manganese, and tungsten.

23. A treatment system for treating a slurry stream comprising at least one metal and at least one oxidizing species present at a concentration of at least about 50 mg/L, the treatment system comprising:

an inlet fluidly connected to a source of the slurry stream; and

means for reducing the concentration of the at least one metal from the slurry stream.

24. The treatment system of claim 23 , wherein the at least one metal is a metal selected from the group consisting of copper, lead, nickel, zinc, cobalt, cadmium, iron, tantalum, silver, gold, platinum, palladium, iridium, rhodium, ruthenium, gallium, manganese, hafnium, and tungsten.

25. The treatment system of claim 23 , wherein the at least one oxidizing species is selected from the group consisting of hydrogen peroxide, ferric nitrate, and ammonium persulfate.

26. The treatment system of claim 23 , further comprising means for neutralizing at least a portion of the at least one oxidizing species.

27. The treatment system of claim 26 , wherein the means for neutralizing at least a portion of the at least one oxidizing species electrochemically, photochemically, and/or thermochemically reduces a concentration of the at least one oxidizing species.

28. A method of facilitating treatment of a slurry stream having at least one metal species, comprising providing a treatment system consisting essentially of an ion exchange column having ion exchange media contained therein, wherein the ion exchange media comprises at least one pendant functional group capable of forming a complex with the at least one metal species.

29. The method of claim 28 , further comprising a step of fluidly connecting an inlet of the treatment system to a source of the slurry stream.

30. The method of claim 28 , further comprising a step of introducing the slurry stream into the treatment system.

31. A treatment system for treating a slurry stream comprising at least one metal and at least one oxidizing species, the treatment system consisting essentially of:

an electrochemical, photochemical or thermochemical pretreatment unit; and

at least one ion exchange column fluidly connected downstream of the pretreatment unit.

32. The system of claim 31 , wherein the ion exchange column contains ion exchange media comprising at least one pendant functional group capable of forming a complex with the at least one metal.

33. The system of claim 32 , wherein the at least one pendant functional group comprises an iminodiacetic functional group.

34. The system of claim 31 , wherein the at least one metal is selected from the group consisting of copper, lead, nickel, zinc, cobalt, cadmium, iron, tantalum, silver, gold, platinum, palladium, iridium, rhodium, ruthenium, gallium, hafnium, manganese, and tungsten.

35. The system of claim 31 , wherein the at least one oxidizing species is present at a concentration of at least about 50 mg/L.

36. A method of facilitating treatment of a chemical mechanical polishing slurry stream, comprising providing a treatment system consisting essentially of an ion exchange column having ion exchange media contained therein, wherein the ion exchange media comprises a cross-linked polystyrene substrate.

37. The method of claim 36 , further comprising introducing the slurry stream into the treatment system.

38. The method of claim 1 , wherein the ion exchange column comprises ion exchange material comprising a cross-linked polystyrene substrate.

39. The method of claim 28 , wherein the ion exchange media comprises a cross-linked polystyrene substrate.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded May 26, 2023
From: JPMORGAN CHASE BANK N.A., AS COLLATERAL AGENT
To: EVOQUA WATER TECHNOLOGIES LLC; NEPTUNE BENSON, INC.
Reel/Frame 063787/0943 →
SECURITY INTEREST Recorded Apr 7, 2021
From: EVOQUA WATER TECHNOLOGIES LLC; NEPTUNE BENSON, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 055848/0689 →
RELEASE OF SECURITY INTEREST (REEL/FRAME 032126/0487) Recorded Apr 6, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
To: SIEMENS WATER TECHNOLOGIES LLC
Reel/Frame 055845/0245 →
RELEASE OF SECURITY INTEREST (REEL/FRAME 032126/0430) Recorded Apr 6, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
To: SIEMENS WATER TECHNOLOGIES LLC
Reel/Frame 055845/0311 →
CHANGE OF NAME Recorded Feb 7, 2014
From: SIEMENS WATER TECHNOLOGIES LLC
To: EVOQUA WATER TECHNOLOGIES LLC
Reel/Frame 032174/0282 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (SECOND LIEN) Recorded Jan 24, 2014
From: WTG HOLDINGS III CORP.; WTG HOLDINGS II CORP.; SIEMENS TREATED WATER OUTSOURCING CORP.; SIEMENS WATER TECHNOLOGIES LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 032126/0430 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (FIRST LIEN) Recorded Jan 24, 2014
From: WTG HOLDINGS III CORP.; WTG HOLDINGS II CORP.; SIEMENS TREATED WATER OUTSOURCING CORP.; SIEMENS WATER TECHNOLOGIES LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 032126/0487 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 1, 2014
From: SIEMENS INDUSTRY, INC.
To: SIEMENS WATER TECHNOLOGIES LLC
Reel/Frame 031896/0256 →
MERGER Recorded Apr 15, 2011
From: SIEMENS WATER TECHNOLOGIES HOLDING CORP.
To: SIEMENS INDUSTRY, INC.
Reel/Frame 026138/0593 →
CHANGE OF NAME Recorded Oct 20, 2006
From: USFILTER CORPORATION
To: SIEMENS WATER TECHNOLOGIES HOLDING CORP.
Reel/Frame 018418/0212 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2005
From: WISMER, MICHAEL W.; WOODLING, RICHARD; DAY, RICHARD C.
To: USFILTER CORPORATION
Reel/Frame 016867/0027 →