Semiconductor device
View Patent ↗There is provided a large capacity memory such as a DRAM and an SDRAM n which bonding pads PS and PD are not located at the center, but are displaced from the center between memory array regions UL and UR, disposed on the upper side of a four-bank structure of banks 0 through 3 , and memory array regions DL and DR, disposed on the lower side thereof. Secondly, the disposition of the bonding pads PS and PD is staggered on the right and left such that the right half bonding pads PD are shifted up relative to the left half bonding pads by about 30 μm. Only a sense amplifier, a column decoder and a main amplifier, which need to be near to the memory array regions DL and DR, are disposed between the bonding pads PS and PD, and the lower memory array regions DL and DR, and further indirect peripheral circuits are disposed on the upper side of the bonding pads PS and PD.
1. A semiconductor memory device formed on a semiconductor substrate comprising:
a plurality of first memory arrays formed in a first region, each of the plurality of first memory arrays having a plurality of first word lines, a plurality of first bit lines across the plurality of first word lines, and a plurality of memory cells arranged at predetermined intersections of the plurality of first word lines and the plurality of first bit lines;
a plurality of second memory arrays formed in a second region, each of the plurality of second memory arrays having a plurality of second word lines, a plurality of second bit lines across the plurality of second word lines, and a plurality of second memory cells arranged at predetermined intersections of the plurality of second word lines and the plurality of second bit lines;
a plurality of data input/output pads formed in a third region; and
a plurality of output circuits coupled to the plurality of data input/output pads and formed in the third region,
wherein the first region, the third region, and the second region are sequentially arranged in a first direction,
wherein the plurality of data input/output pads are arranged between a center axis of the first direction of the semiconductor substrate and the first region,
wherein no data input/output pads are arranged between the center axis of the first direction of the semiconductor substrate and the second region,
wherein each of the plurality of output circuits has a first transistor whose source is coupled to a first voltage line and whose drain is coupled to a corresponding one of the plurality of data input/output pads and a second transistor whose source is coupled to a second voltage line and whose drain is coupled to the corresponding one of the plurality of data input/output pads,
wherein the first transistors are arranged between the plurality of data input/output pads and the first region, and
wherein the second transistors are arranged between the plurality of data input/output pads and the second region.
2. A semiconductor memory device according to claim 1 , further comprising:
a first circuit arranged between the center axis of the first direction of the semiconductor substrate and the second region;
a third voltage line coupled to the first circuit;
a first pad coupled to the first voltage line;
a second pad coupled to the second voltage line; and
a third pad coupled to the third voltage line;
wherein the first voltage line is arranged between the first region and the plurality of data input/output pads, and
wherein the second and third voltage lines are arranged between the second region and the plurality of data input/output pads.
3. A semiconductor memory device according to claim 1 , further comprising:
indirect peripheral circuits,
wherein the indirect peripheral circuits are arranged between the second region and the plurality of data input/output pads.
4. A semiconductor memory device according to claim 1 , further comprising:
voltage generating circuits,
wherein the voltage generating circuits are arranged between the second region and the plurality of data input/output pads, and
wherein no voltage generating circuits are arranged between the first region and the plurality of data input/output pads.
5. A semiconductor memory device according to claim 1 , further comprising:
a plurality of address pads for inputting address signals,
wherein the third region is divided into a fourth region and a fifth region by a center axis of a second direction of the semiconductor substrate, the second direction crossing the first direction,
wherein the plurality of data input/output pads are arranged in the fourth region, and
wherein the plurality of address pads are arranged at the fifth region.
6. A semiconductor memory device according to claim 5 ,
wherein a distance between the plurality of address pads and the center axis of the first direction of the semiconductor substrate is shorter than a distance between the plurality of data input/output pads and the center axis of the first direction of the semiconductor substrate.
7. A semiconductor memory device according to claim 5 , further comprising:
a plurality of electrostatic protecting elements coupled to the plurality of address pads,
wherein the plurality of electrostatic protecting elements are arranged between the plurality address pads and the second region.
8. A semiconductor memory device according to claim 1 ,
wherein the first transistor is a NMOS transistor and the second transistor is a PMOS transistor, and
wherein a voltage supplied to the first voltage line is smaller than a voltage supplied to the second voltage line.
9. A semiconductor memory device according to claim 1 , wherein the semiconductor memory device is a DRAM.
10. A semiconductor memory device formed on a semiconductor substrate comprising:
a first memory bank formed in a first rectangle region;
a second memory bank formed in a second rectangle region;
a plurality of bonding pads formed in a third rectangle region; and
a plurality of voltage generators formed in a fourth rectangle region,
wherein the first rectangle region, the third rectangle region, the fourth rectangle region, and the second region are sequentially arranged in a first direction,
wherein a distance between each of the plurality of bonding pads and the first region is shorter than a distance between each of the plurality of bonding pads and the second region,
wherein the plurality of bonding pads include a plurality of data signal pads, wherein no data signal pads are formed in the fourth region, wherein the plurality of data signal pads are coupled to a plurality of output circuits,
wherein each of the plurality of output circuits has a first transistor whose drain is coupled to a corresponding one of the plurality of data signal pads and a second transistor whose drain is coupled to the corresponding one of the plurality of data signal pads,
wherein the first transistors are arranged, respectively, between the first region and a corresponding one of the plurality of data signal pads,
wherein the second transistors are arranged, respectively, between the second region and a corresponding one of the plurality of data signal pads.
11. A semiconductor memory device according to claim 10 , further comprising:
a first voltage line coupled to sources of the first transistors; and
a second voltage line coupled to sources of the second transistors;
wherein the plurality of bonding pads further include a first pad coupled to the first voltage line and a second pad coupled to the second voltage line,
wherein each of the first transistors is a NMOS transistor and each of the second transistor is a PMOS transistor,
wherein the first voltage line is arranged between the plurality of data signal pads and the first region, and
wherein the second voltage line is arranged between the plurality of data signal pads and the second region.
12. A semiconductor memory device according to claim 11 ,
wherein the first and second pads are arranged between the plurality of data signal pads.
13. A semiconductor memory device according to claim 11 , further comprising:
a third voltage line coupled to the plurality of voltage generators,
wherein the plurality of bonding pads further include a third pad coupled to the third voltage line, and
wherein the third voltage line is arranged between the plurality of data signal pads and the second region.
14. A semiconductor memory device according to claim 11 ,
wherein the plurality of bonding pads further include a plurality of address pads,
wherein the third region is divided into a fifth region and a sixth region by a center axis of a second direction of the semiconductor substrate, the second direction crossing the first direction,
wherein the plurality of the data signal pads is formed in the fifth region, and
wherein the plurality of the address pads is formed in the sixth region.
15. A semiconductor memory device according to claim 14 further comprising:
a plurality of electrostatic protection elements coupled to the plurality of address pads,
wherein the plurality of electrostatic protection elements are formed between the plurality of address pads and the second region.
16. A semiconductor memory device according to claim 14 ,
wherein a distance between the first region and each of the plurality of address pads is shorter than a distance between the first region and each of the plurality of data signal pads.
17. A semiconductor memory device according to claim 10 ,
wherein no bonding pads are formed in the first region.
18. A semiconductor memory device according to claim 10 ,
wherein the semiconductor memory device is a DRAM.