Solid-state imaging device and manufacturing method of solid-state imaging device
View Patent ↗An object of the present invention is to provide a solid-state imaging device that can be slimmed down and have an improved picture quality without sacrificing its sensitivity and the manufacturing method of the solid-state imaging device. The solid-state imaging device includes an imaging unit where unit cells are arranged in a two-dimensional array. Each of these unit cells has a photodiode and a first microlens and a second microlens which are formed above the photodiode. The maximum curvatures of the convex parts become greater from the center part to the periphery of the imaging unit.
1. A solid-state imaging device comprising:
an image capturing unit having unit cells arranged in a two-dimensional array, each unit cell including a photoelectric conversion element and an upward convex microlens disposed above the photoelectric conversion element, at least one unit cell being positioned in a peripheral part of the image capturing unit,
wherein a summit of the upward convex microlens in the at least one unit cell positioned in the peripheral part of the image capturing unit is displaced from a center thereof to a point closer to a center part of the image capturing unit,
wherein at least one unit cell is positioned in the center part of the image capturing unit, and the upward convex microlens in the at least one unit cell in the center part of the image capturing unit has a cross-sectional shape that is line symmetric with respect to a line which (i) is perpendicular to a light incidence surface of the photoelectric conversion element and (ii) passes through a summit thereof, and
the upward convex microlens which is in the at least one unit cell in the peripheral part of the image capturing unit has a cross-sectional shape that is line asymmetric with respect to the line which (i) is perpendicular to the light incidence surface of the photoelectric conversion element and (ii) passes through the summit thereof.
2. The solid-state imaging device according to claim 1 , wherein each upward convex microlens has a summit, and displacement levels of the summits of the upward convex microlenses of the unit cells increase from the center part to the peripheral part of the image capturing unit.
3. The solid-state imaging device according to claim 1 ,
wherein a maximum curvature of the upward convex microlens in the at least one unit cell positioned in the peripheral part of the image capturing unit is greater than a maximum curvature of the upward convex microlens in the at least one unit cell positioned in the center part of the image capturing unit.
4. The solid-state imaging device according to claim 3 ,
wherein the maximum curvatures of the upward convex microlenses of the unit cells increase from the center part to the peripheral part of the image capturing unit.
5. The solid-state imaging device according to claim 1 , wherein a bottom surface of each upward convex microlens is flat.
6. A solid-state imaging device comprising:
an image capturing unit having unit cells arranged in a two-dimensional array, each unit cell including a photoelectric conversion element and an upward convex microlens disposed above the photoelectric conversion element, at least one unit cell being positioned in a peripheral part of the image capturing unit,
wherein a summit of the upward convex microlens in the at least one unit cell positioned in the peripheral part of the image capturing unit is displaced from a center thereof to a point closer to a center part of the image capturing unit,
wherein each unit cell includes an inter-layer lens disposed between the upward convex microlens and the photoelectric conversion element, and
wherein a summit of the inter-layer lens in the at least one unit cell in the peripheral part of the image capturing unit is displaced from a center of the inter-layer lens to a point closer to the center part of the image capturing unit.
7. The solid-state Imaging device according to claim 6 ,
wherein at least one unit cell is positioned in the center part of the image capturing unit, and a maximum curvature of the inter-layer lens in the at least one unit cell in the peripheral part of the image capturing unit is greater than a maximum curvature of the inter-layer lens in the at least one unit cell in the center part of the image capturing unit.
8. The solid-state imaging device according to claim 6 , wherein a bottom surface of the inter-layer lens is flat.
9. The solid-state imaging device according to claim 6 , wherein each upward convex microlens has a summit, and displacement levels of the summits of the upward convex microlenses of the unit cells increase from the center part to the peripheral part of the image capturing unit.
10. The solid-state imaging device according to claim 7 , wherein the maximum curvatures of the upward convex microlenses of the unit cells increase from the center part to the peripheral part of the image capturing unit.