Multiple component field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components
View Patent ↗A field-replaceable active pumped liquid heat sink module includes a front portion and a back portion, each including a liquid pump, a radiator, an optional receiver, and a cold plate heat exchanger, all of which are connected together in a liquid pump loop through which a coolant such as water is circulated. The liquid pump, radiator, optional receiver and cold plate heat exchanger are in a liquid pump loop and are self-contained in a field-replaceable active pumped liquid heat sink module.
1. A field-replaceable, self-contained heat sink module employing active liquid cooling of a plurality of electronic components comprising:
a common heat sink casing;
a front portion and a back portion forming, in combination with the common heat sink casing, the modular self-contained heat sink module, each portion including:
a radiator heat exchanger including a hot liquid output line and a cold liquid return line;
a cold plate heat exchanger embedded in the heat sink casing, wherein the heat sink casing is in direct contact with the plurality of electronic components, the cold plate heat exchanger having an input coupled to a cold liquid input line, and an output coupled to the hot liquid output line;
a liquid pump having an input port coupled to the cold liquid return line and an output port coupled to the cold liquid input line, wherein the entire liquid pump apparatus including the radiator heat exchanger, cold plate heat exchanger, and liquid pump is hermetically sealed and contained within the heat sink module; and
an electrical connection for receiving electrical pump power.
2. The multi-component heat sink module of claim 1 wherein the overall dimensions of the heat sink casing are about 7.0 inches by 5.0 inches by 1.75 inches.
3. The multi-component heat sink module of claim 1 wherein a remaining thickness at the bottom of the heat sink casing is between about 2.0 and 5.0 mm.
4. The multi-component heat sink module of claim 1 wherein the cold plate heat exchanger comprises a micro-channel heat exchanger.
5. The multi-component heat sink module of claim 1 wherein a cooling fluid used in the radiator heat exchanger, cold plate heat exchanger, and pump comprises water.
6. The multi-component heat sink module of claim 1 wherein a cooling fluid used in the radiator heat exchanger, cold plate heat exchanger, and pump comprises a mixture of water and glycol.
7. The multi-component heat sink module of claim 1 wherein a cooling fluid flows through the radiator heat exchanger, cold plate heat exchanger, and pump in a closed system without any phase change.
8. The multi-component heat sink module of claim 1 wherein the overall dimensions of the liquid pump are about 1.5 inches in diameter and between 3.0 to 4.0 inches long.
9. The multi-component heat sink module of claim 1 wherein the liquid pump comprises a brushless miniature spherical pump, a miniature diaphragm pump or a positive displacement pump.
10. A field-replaceable, self-contained heat sink module employing active liquid cooling of a plurality of electronic components comprising:
a common heat sink casing;
a front portion and a back portion forming, in combination with the common heat sink casing, the modular self-contained heat sink module each portion including:
a radiator heat exchanger;
a cold plate heat exchanger embedded in the heat sink casing, wherein the heat sink casing is in direct contact with the plurality of electronic components; and
a liquid pump having electrical connections for receiving electrical pump power, wherein the radiator heat exchanger, cold plate heat exchanger, and liquid pump are physically coupled together to form a closed active liquid cooling system that is hermetically sealed and self-contained within the heat sink module.
11. The multi-component heat sink module of claim 10 wherein the overall dimensions of the heat sink casing are about 7.0 inches by 5.0 inches by 1.75 inches.
12. The multi-component heat sink module of claim 10 wherein a remaining thickness at the bottom of the heat sink casing is between about 2.0 and 5.0 mm.
13. The multi-component heat sink module of claim 10 wherein the cold plate heat exchanger comprises a micro-channel heat exchanger.
14. The multi-component heat sink module of claim 10 wherein a cooling fluid used in the radiator heat exchanger, cold plate heat exchanger, and pump comprises water.
15. The multi-component heat sink module of claim 10 wherein a cooling fluid used in the radiator heat exchanger, cold plate heat exchanger, and pump comprises a mixture of water and glycol.
16. The multi-component heat sink module of claim 10 wherein a cooling fluid flows through the radiator heat exchanger, cold plate heat exchanger, and pump in a closed system without any phase change.
17. The multi-component heat sink module of claim 10 wherein the overall dimensions of the liquid pump are about 1.5 inches in diameter and between 3.0 to 4.0 inches long.
18. The multi-component heat sink module of claim 10 wherein the liquid pump comprises a brushless miniature spherical pump, a miniature diaphragm pump or a positive displacement pump.