Solid-state imaging device and method for manufacturing the same
A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers.
1 - 17 . (canceled)
18 . The solid-state imaging device according to claim 23 , wherein the solid-state imaging element and the inner surface of the spacer are separated by 50 μm to 100 μm over the whole edge of the solid-state imaging element.
19 . The solid-state imaging device according to claim 23 , wherein the width of the spacer is 100 μm to 500 μm.
20 . The solid-state imaging device according to claim 23 , wherein chamfer edges are formed in the surface of the spacer to which the adhesive is applied, the surplus adhesive is contained in the space between the wafer and the chamfer edges.
21 . A solid-state imaging device that comprises a solid-state imaging element on a chip wafer, a frame-shaped spacer bounded on the chip wafer via an adhesive, and a transparent plate on the spacer to seal the solid-state imaging element, the solid-state imaging element being surrounded by the spacer;
wherein the solid-state imaging element and the inner surface of the spacer are separated by 50 μm to 100 μm over the whole edge of the solid-state imaging element.
22 . A solid-state imaging device that comprises a solid-state imaging element on a chip wafer, a frame-shaped spacer bounded on the chip wafer via an adhesive, and a transparent plate on the spacer to seal the solid-state imaging element, the solid-state imaging element being surrounded by the spacer;
wherein the width of the spacer is 100 μm to 500 μm.
23 . A solid-state imaging device manufactured by sticking a transparent substrate, in which plural frame-shaped spacers are formed, via an adhesive to a wafer on which plural solid-state imaging elements are formed, and by dividing the transparent substrate and the wafer for each solid-state imaging element, each of the solid-state imaging elements on the wafer being surrounded by each of the spacers, the method comprising the steps of:
sticking a transfer member, to which the adhesive is applied, to the spacer;
applying pressure to the transparent substrate and the transfer member; and
releasing the transfer member from the transparent substrate to transfer the adhesive on the spacer.