Flame-retardant epoxy resin composition, and electronic device, laminated circuit board, multilayered circuit board and printed circuit board using the flame-retardant epoxy resin composition
View Patent ↗A flame-retardant epoxy resin composition, as well as an electronic device, a laminated circuit board, a multilayered circuit board and a printed circuit board employing the flame-retardant epoxy resin composition are disclosed. The flame-retardant epoxy resin composition contains: an epoxy resin; an epoxy resin curing agent; and flame-retardant particles containing a metal hydrate. The flame-retardant particles are provided with a coating layer on the surfaces thereof and have a volume average particle diameter in a range from 1 to 500 nm.
1. A laminated circuit board comprising a flame-retardant epoxy resin composition, comprising:
an epoxy resin;
an epoxy resin curing agent; and
flame-retardant particles containing a metal hydrate, with a coating layer on a surface of the flame retardant particles and having a volume average particle diameter in a range from 1 to 500 nm,
wherein the coating layer is a coating compound having a mass percentage range of 30-80% with respect to the metal hydrate.
2. The laminated circuit board of claim 1 , wherein the flame-retardant particles have a total light transmittance in a range from 70 to 90% when 0.1 parts by mass of the flame-retardant particles are dispersed in 100 parts by mass of toluene.
3. The laminated circuit board of claim 1 , wherein the metal hydrate is a hydrate of metals comprising Mg and one selected from the group consisting of Ca, Al, Fe, Zn, Ba, Cu and Ni.
4. The laminated circuit board of claim 1 , wherein the metal hydrate is a hydrate of a metal selected from the group consisting of Mg, Ca, Al, Fe, Zn, Ba, Cu and Ni.
5. The laminated circuit board of claim 1 , wherein the coating layer includes an organic compound or a polysilicone.
6. The laminated circuit board of claim 1 , the flame-retardant epoxy resin composition further comprising a flame-retardant auxiliary selected from the group consisting of boric acid based flame-retardant auxiliaries, ammon based flame-retardant auxiliaries, inorganic flame-retardant auxiliaries, nitrogen based flame-retardant auxiliaries, organic flame-retardant auxiliaries and colloidal flame-retardant auxiliaries.
7. The laminated circuit board of claim 1 , the flame-retardant epoxy resin composition further comprising a curing accelerator.
8. The laminated circuit board of claim 1 , the flame-retardant epoxy resin composition further comprising a filler.
9. A laminated circuit board of claim 1 , wherein the volume average particle diameter of the flame-retardant particles is in a range from 10 to 80 nm.
10. The laminated circuit board of claim 1 , wherein the flame-retardant particles have a total light transmittance in a range from 85 to 90% when 0.1 parts by mass of the flame-retardant particles are dispersed in 100 parts by mass of toluene.
11. A multilayered circuit board comprising a flame-retardant epoxy resin composition, comprising:
an epoxy resin;
an epoxy resin curing agent; and
flame-retardant particles containing a metal hydrate, with a coating layer on a surface of the flame retardant particles and having a volume average particle diameter in a range from 1 to 500 nm,
wherein the coating layer is a coating compound having a mass percentage range of 30-80% with respect to the metal hydrate.
12. The multilayered circuit board of claim 11 , wherein the flame-retardant particles have a total light transmittance in a range from 70 to 90% when 0.1 parts by mass of the flame-retardant particles are dispersed in 100 parts by mass of toluene.
13. The multilayered circuit board of claim 11 , wherein the metal hydrate is a hydrate of metals comprising Mg and one selected from the group consisting of Ca, Al, Fe, Zn, Ba, Cu and Ni.
14. The multilayered circuit board of claim 11 , wherein the metal hydrate is a hydrate of a metal selected from the group consisting of Mg, Ca, Al, Fe, Zn, Ba, Cu and Ni.
15. The multilayered circuit board of claim 11 , wherein the coating layer includes an organic compound or a polysilicone.
16. The multilayered circuit board of claim 11 , the flame-retardant epoxy resin composition further comprising a flame-retardant auxiliary selected from the group consisting of boric acid based flame-retardant auxiliaries, ammon based flame-retardant auxiliaries, inorganic flame-retardant auxiliaries, nitrogen based flame-retardant auxiliaries, organic flame-retardant auxiliaries and colloidal flame-retardant auxiliaries.
17. The multilayered circuit board of claim 11 , the flame-retardant epoxy resin composition further comprising a curing accelerator.
18. The multilayered circuit board of claim 11 , the flame-retardant epoxy resin composition further comprising a filler.
19. The multilayered circuit board of claim 11 , the flame-retardant epoxy resin composition wherein the volume average particle diameter of the flame-retardant particles is in a range from 10 to 80 nm.
20. The multilayered circuit board of claim 11 , wherein the flame-retardant particles have a total light transmittance in a range from 85 to 90% when 0.1 parts by mass of the flame-retardant particles are dispersed in 100 parts by mass of toluene.