IP Library Granted Patent US 7,345,314
Granted Patent B2
US 7,345,314 · App. 11/202,340 · Granted Mar 18, 2008

Organic light emitting diode display and manufacturing method thereof

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Quick Facts
Patent No.
US 7,345,314
App. No.
11/202,340
Granted
Mar 18, 2008
Kind
B2
Abstract

An organic light emitting diode display includes an insulating layer, a stress buffer disposed on the insulating layer, a first electrode disposed on the stress buffer, an organic light emitting member disposed on the first electrode, and a second electrode disposed on the organic light emitting member.

Claims (35)

1. An organic light emitting diode display comprising:

an insulating layer;

a stress buffer disposed on the insulating layer;

a first electrode disposed on the stress buffer;

an organic light emitting member disposed on the first electrode; and

a second electrode disposed on the organic light emitting member,

wherein the stress buffer has a thermal expansion coefficient between a thermal expansion coefficient of the insulating layer and a thermal expansion coefficient of the first electrode.

2. The organic light emitting diode display of claim 1 , wherein the insulating layer comprises an organic material.

3. The organic light emitting diode display of claim 2 , wherein the insulating layer is hardened by heat.

4. The organic light emitting diode display of claim 1 , wherein, the stress buffer comprises at least one of ITO, IZO, or Mo.

5. The organic light emitting diode display of claim 1 , wherein the first electrode comprises at least one of Cr, Al, or Ag.

6. The organic light emitting diode display of claim 1 , wherein the first electrode comprises Cr and the stress buffer comprises at least one of Si, W, or Mo.

7. The organic light emitting diode display of claim 1 , wherein the first electrode comprises Ag and the stress buffer comprises at least one of Si, W, Mo, Cr, Ge, Nb, Ti, Pt, Ni, Au, or Cu.

8. The organic light emitting diode display of claim 1 , wherein the first electrode comprises Al and the stress buffer comprises at least one of Si, W, Mo, Cr, Ge, Nb, Ti, Pt, Ni, Au, Cu, or Mn.

9. The organic light emitting diode display of claim 1 , wherein the first electrode comprises a reflective material and the second electrode comprises a transparent material.

10. The organic light emitting diode display of claim 9 , further comprising a third electrode disposed between the first electrode and the organic light emitting member.

11. The organic light emitting diode display of claim 10 , wherein the third electrode has a higher work function than the first electrode.

12. The organic light emitting diode display of claim 10 , wherein the third electrode comprises ITO or IZO.

13. The organic light emitting diode display of claim 1 , wherein the stress buffer has substantially the same planar shape as the first electrode.

14. The organic light emitting diode display of claim 1 , further comprising:

a gate line transmitting a gate signal;

a data line transmitting a data signal;

a driving voltage line transmitting a driving voltage;

a switching transistor coupled to the gate line and the data line; and

a driving transistor coupled to the switching transistor, the driving voltage line, and the first electrode.

15. The organic light emitting diode display of claim 14 , further comprising a connecting member disposed on the insulating layer and connecting the switching transistor and the driving transistor.

16. A method of manufacturing an organic light emitting diode display, the method comprising:

forming an insulating layer;

forming a stress buffer on the insulating layer;

forming a first electrode on the stress buffer;

forming an organic light emitting member on the first electrode; and

forming a second electrode on the organic light emitting member,

wherein the stress buffer has a thermal expansion coefficient between a thermal expansion coefficient of the insulating layer and a thermal expansion coefficient of the first electrode.

17. The method of claim 16 , further comprising:

hardening the insulating layer at a temperature of about 200° C. to about 300° C.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029045/0860 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2005
From: CHUNG, JAE-HOON; KIM, NAM-DEOG; RHEE, JUNG-SOO; CHOI, BEOHM-ROCK; LIM, JONG-SUN; JEONG, CHANG-OH
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 016887/0396 →