Composite materials including high modulus polyolefin fibers
View Patent ↗Disclosed are composite laminates that can exhibit high strength and/or low dielectric loss and can also be lightweight. The laminates include layers formed of high modulus polyolefin fiber. The fibers can be woven or knit to form a fabric or can be included in a nonwoven fabric that can be one or more layers of the composite structures. The layers including the high modulus polyolefin fibers can include other fibers, such as fiberglass. The composites can also include layers of other materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, or in applications beneficially combining strength with low weight, such as automobile and boat materials.
1. A multi-layer composite structure comprising:
a plurality of melt extruded multi-filament semi-crystalline polypropylene fibers having a modulus greater than about 8 GPa, a maximum cross sectional dimension less than about 100 microns, and at least one of the following characteristics: a) greater than 80% crystallinity according to WAXS measuring techniques, and b) a ratio of equatorial intensity to meridonal intensity of greater than 1.0 as measured by SAXS techniques;
a first layer comprising the polypropylene fibers, wherein said first layer includes, on its surface, one or more of the following treatments: i) at least one thermoset resin-reactive group, ii) size, or iii) fibrillations;
a polymeric bonding agent, wherein said surface treatments of said first layer impart increased bonding strength with said polymeric binding agent; and
a second layer;
wherein the polymeric binding agent secures the first layer to the second layer.
2. The multi-layer composite structure of claim 1 , wherein the fabric comprises a plurality of composite yarns comprising the polypropylene fibers.
3. The multi-layer composite structure of claim 1 , wherein the first layer is a weave fabric comprising the polypropylene fibers in an interlaced pattern with a plurality of second fibers.
4. The multi-layer composite structure of claim 1 , in which the second layer comprises a plurality of a third fiber in a polymeric matrix.
5. The multi-layer composite structure of claim 1 , in which the second layer comprises a metal.
6. The multi-layer composite structure of claim 1 , in which the binding agent is a thermoplastic having a melting temperature lower than that of the polyolefin fiber.
7. The multi-layer composite structure of claim 1 , in which the binding agent is a thermoset resin.
8. The multi-layer composite structure of claim 1 , in which the polypropylene fibers comprise semi-detached fibers attached to a melt extruded polypropylene film.
9. The multi-layer composite structure of claim 1 , in which the composite structure has a density less than about 1.5 g/cm 3 and a flexural strength greater than about 80 MPa.
10. The multi-layer composite structure of claim 1 , in which the composite structure has a density less than about 1.2 g/cm 3 and a flexural modulus greater than about 3 GPa.
11. The multi-layer composite structure of claim 1 , in which the composite structure has a dielectric constant of less than about 3.5.
12. A multi-layer composite structure comprising:
a fabric first layer comprising a plurality of melt extruded multi-filament semi-crystalline polypropylene fibers having a modulus greater than about 10 GPa, a maximum cross sectional dimension less than about 100 microns, and at least one of the following characteristics: a) greater than 80% crystallinity according to WAXS measuring techniques, and b) a ratio of equatorial intensity to meridonal intensity of greater than 1.0 as measured by SAXS techniques, wherein said first layer includes, on its surface, one or more of the following treatments: i) at least one thermoset resin-reactive group, ii) size, or iii) fibrillations;
a second layer; and
a thermoset resin polymeric bonding agent securing the first layer to the second layer, wherein said surface treatments of said first layer impart increased bonding strength between said first layer and said thermoset resin polymeric bonding agent;
wherein the composite structure has an average density less than about 1.5 g/cm 3 , a flexural strength greater than about 100 MPa, and a flexural modulus greater than about 10 GPa.
13. The multi-layer composite structure of claim 12 , wherein the fabric comprises the polypropylene fibers and a plurality of second fibers.
14. The multi-layer composite structure of claim 12 , in which the second layer is discontinuous across the first layer.
15. The multi-layer composite structure of claim 12 , in which the second layer is a nonwoven fabric comprising a plurality of a third fiber in a polymeric matrix.
16. The multi-layer composite structure of claim 12 , in which the composite structure has a dielectric constant of less than about 3.0.
17. A laminate structure comprising:
a first and second outer layer, wherein the first and second outer layers comprise a polypropylene fiber with a modulus greater than about 20 GPa and a maximum cross-sectional dimension of less than about 100 microns;
a plurality of inner layers, wherein at least one inner layer is a weave fabric comprising a plurality of melt-extruded fibers having a modulus of at least 8 GPa, a tenacity greater than about 400 MPa, and a density of less than about 1.3 g/cm 3 , wherein said fibers are either fibrillated, corona- or plasma-treated, or sized;
a binding agent adhering at least two layers of the laminate structure together; and
wherein the laminate structure has an average density of less than about 1.5 g/cm 3 .
18. The laminate structure of claim 17 , wherein the outer layers are fiberglass fabrics.
19. The laminate structure of claim 17 , wherein the laminate structure is a circuit board, a radome, or a vehicle portion.