Method of packaging and interconnection of integrated circuits
View Patent ↗A method is disclosed for packaging semiconductor chips on a flexible substrate employing thin film transfer. The semiconductor chips are placed on a temporary adhesive substrate, then covered by a permanent flexible substrate with a casting layer for planarizingly embedding the chips on the permanent substrate before removing the temporary substrate. With the surface of the chips coplanar with the surface of the complete structure without any gaps, interconnect metal lines can be easily placed on the uninterrupted surface, connecting the chips and other components.
1. A method for packaging semiconductor chips comprising steps in an order of
providing a temporary substrate;
coating the temporary substrate with a releasable adhesive layer;
placing a semiconductor chip on a portion of the releasable adhesive layer;
casting a polymer layer to cover the semiconductor chip and the releasable adhesive layer to smooth out a height difference of the polymer layer between the height above the chip and that at surrounding area without the chip, wherein the polymer layer does not substantially interfere with the releasability of the releasable adhesive layer; and
laminating a permanent substrate on the polymer layer and releasing the releasable adhesive layer to remove the temporary substrate.
2. A method as in claim 1 further comprising a step of cleaning a surface of the chip after releasing the temporary substrate.
3. A method as in claim 2 wherein the cleaning step is a plasma cleaning.
4. A method as in claim 2 wherein the cleaning step is a solvent cleaning.
5. A method as in claim 1 further comprising a step of forming interconnect after the releasing of the temporary substrate.
6. A method as in claim 1 further comprising a step of forming a via through the casting layer.
7. A method as in claim 6 further comprising a step of forming an interconnection on the casting layer through the via.
8. A method as in claim 1 , in which the casting step comprises coating an intermediate layer before casting the polymer layer, wherein the intermediate layer prevents the intermixing or desolving the releasable adhesive by the polymer layer.
9. A method as in claim 1 wherein the releasable adhesive layer is a thermal decomposable polymer.
10. A method as in claim 1 wherein the polymer layer has similar coefficient of thermal expansion as silicon.
11. A method as in claim 1 wherein the permanent substrate is a flexible substrate.
12. A method as in claim 1 wherein the semiconductor chip is thinned to less than 100 microns.
13. A method as in claim 1 wherein the polymer layer completely covers the chip.
14. A method as in claim 1 further wherein the step of laminating the permanent substrate comprises the coating a permanent adhesive layer to improve the adhesion of the permanent substrate.
15. A method for packaging semiconductor chips comprising steps in an order of
providing a temporary substrate;
coating the temporary substrate with a releasable adhesive layer;
placing a semiconductor chip on a portion of the releasable adhesive layer;
casting a polymer layer to cover the semiconductor chip and the releasable adhesive layer to smooth out a height difference of the polymer layer between the height above the chip and that at surrounding area without the chip, wherein the polymer layer does not substantially interfere with the releasability of the releasable adhesive layer; and
laminating a flexible permanent substrate on the polymer layer;
releasing the releasable adhesive layer to remove the temporary substrate; and
forming an interconnect on for the semiconductor chip.
16. A method as in claim 15 further comprising a step of laminating a plurality of chip embedded flexible permanent substrates to form a multiple substrate structure.