IP Library Granted Patent US 7,195,523
Granted Patent B2
US 7,195,523 · App. 11/208,092 · Granted Mar 27, 2007

Electrical conductive path for a medical electronics device

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Quick Facts
Patent No.
US 7,195,523
App. No.
11/208,092
Granted
Mar 27, 2007
Kind
B2
Abstract

An electrical conductive path for medical electronic device generally includes a plurality of stackable molded non-conductive housing with each housing having a bore therethrough alignable with adjacent housing bores. The adjacent housings and define any combination when stacked, spaced apart slots for receiving a plurality of electrically conductive spring rings. A plurality of electrically conducting garter springs are disposed within corresponding spring rings and a cable is provided including wires attached to corresponding spring rings.

Claims (27)

1. An electrical conductive path for a medical electronic device, the conductive path comprising:

a plurality of stackable molded non-conductive housings, each housing having a bore therethrough alignable with adjacent housing bores, said adjacent housings defining, in combination, spaced apart slots;

a plurality of electrically conductive spring rings, each ring disposed in a corresponding slot;

a plurality of electrically conducting garter springs, each spring disposed within a corresponding spring ring;

snap fittings removably holding the adjacent housings to each other; and

a cable having a plurality of wires, each wire attached to a corresponding spring ring.

2. The path according to claim 1 wherein each housing includes an alignable hole and the path further comprises pins for aligning the housing holes.

3. The path according to claim 1 wherein the adjacent housing further define, in combination, seal grooves and the path further comprises a plurality of washer seals, each washer seal being disposed in a corresponding seal groove.

4. The path according to claim 3 further comprising snap fittings removably holding adjacent housings to each other.

5. The path according to claim 1 wherein the housing includes windows exposing the spring rings.

6. The path according to claim 5 wherein the wires are attached to the corresponding spring rings within the windows.

7. The path according to claim 1 , wherein said snap fittings comprise overlapping circumferential portions of each adjacent housings.

8. An electrical conductive path for a medical electronic device, the conductive path comprising:

a header;

a plurality of stackable molded non-conductive housings disposed in said header, each housing having a bore therethrough alignable with adjacent housing bores, said adjacent housings defining, in combination, spaced apart slots;

a plurality of electrical conductive spring rings, each ring disposed in a corresponding slot;

a plurality of electrically conducting garter springs, each spring disposed within a corresponding spring ring;

a cable having a plurality of wires, each wire attached to a corresponding spring ring;

a lead including a rod receivable by the housing bores, said rod having a plurality of spaced apart electrical terminals corresponding to the spaced apart spring slots;

snap fittings removably holding the adjacent housings to each other; and

a latch removably holding the rod in position within the bores with electrical connection between corresponding rod terminals and springs.

9. The path according to claim 8 wherein each housing includes an alignable hole and the path further comprises pins for aligning the housing holes.

10. The path according to claim 8 , wherein the adjacent housing further define, in combination, seal grooves and the path further comprises a plurality of washer seals, each washer seal being disposed in a corresponding seal groove.

11. The path according to claim 10 further comprising snap fittings removably holding adjacent housings to each other.

12. The path according to claim 8 wherein the housing includes windows exposing the spring rings.

13. The path according to claim 12 wherein the wires are attached to the corresponding spring rings within the windows.

14. The path according to claim 8 wherein said snap fittings comprise overlapping circumferential portions of each adjacent housings.

Assignments (6)
SECURITY INTEREST Recorded Feb 27, 2025
From: X-MICROWAVE, LLC; TANTALUM PELLET COMPANY, LLC; EVANS CAPACITOR COMPANY, LLC; PACIFIC AEROSPACE & ELECTRONICS, LLC; OHIO ASSOCIATED ENTERPRISES, LLC; FILCONN, LLC; HERMETIC SOLUTIONS GROUP INC.; RUBBERCRAFT CORPORATION OF CALIFORNIA, LTD.; SWIFT TEXTILE METALIZING LLC; RMB PRODUCTS; BAL SEAL ENGINEERING, LLC; KAMATICS CORPORATION; BEI PRECISION SYSTEMS & SPACE COMPANY, INC.; PAKTRON LLC; OHMEGA TECHNOLOGIES, LLC; TICER TECHNOLOGIES, LLC; CUSTOM INTERCONNECTS, LLC; SANDERS INDUSTRIES HOLDINGS, INC.; AKROFIRE, LLC; KAMAN AEROSPACE CORPORATION; KAMAN CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 070344/0430 →
RELEASE OF INTELLECTUAL PROPERTY SECURITY AGREEMENTS (PATENTS) AT REEL 067175/FRAME 0740 Recorded Feb 27, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: KAMAN CORPORATION; KAMAN AEROSPACE CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC; KAMATICS CORPORATION
Reel/Frame 070347/0014 →
RELEASE OF SECURITY INTEREST Recorded Apr 23, 2024
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: KAMATICS CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC
Reel/Frame 067200/0800 →
IP SECURITY AGREEMENT Recorded Apr 22, 2024
From: KAMAN CORPORATION; KAMAN AEROSPACE CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC; KAMATICS CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 067175/0740 →
AMENDED AND RESTATED PATENT COLLATERAL SECURITY AND PLEDGE AGREEMENT Recorded Sep 18, 2020
From: KAMATICS CORPORATION; BAL SEAL ENGINEERING, LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 054304/0388 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 19, 2005
From: NAVIAUX, JACQUES
To: BAL SEAL ENGINEERING CO., INC.
Reel/Frame 016888/0623 →