IP Library Granted Patent US 7,581,307
Granted Patent B2
US 7,581,307 · App. 11/208,687 · Granted Sep 1, 2009

Method of making an electric machine having an electronics mount secured by an interference fit

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Quick Facts
Patent No.
US 7,581,307
App. No.
11/208,687
Granted
Sep 1, 2009
Kind
B2
Abstract

A method includes heating a housing of an electric machine to thermally expand the housing, positioning a mount having power and control electronics assembled thereon and in contact therewith in the housing and against an internal stop defined within the housing, and allowing the housing to cool and thermally contract against the mount thereby forming an interference fit between the housing and the mount. The interference fit secures the mount within the housing. The mount and the housing have coefficients of thermal expansion such that the interference fit is maintained across an operating temperature range of the machine. The electric machine may also include a segmented or non-segmented stator within the housing.

Claims (6)

1. A method comprising heating a housing of an electric machine to thermally expand the housing, positioning a mount having power and control electronics assembled thereon and in contact therewith in the housing and against an internal stop defined within the housing, and allowing the housing to cool and thermally contract against the mount thereby forming an interference fit between the housing and the mount, the interference fit securing the mount within the housing, wherein the mount and the housing have coefficients of thermal expansion such that the interference fit is maintained across an operating temperature range of the machine.

2. The method of claim 1 , wherein the mount has a coefficient of thermal expansion about equal to or greater than the housing's coefficient of thermal expansion.

3. The method of claim 1 , further comprising mounting power and control electronics to the mount before positioning the mount within the housing.

4. The method of claim 1 , wherein the interference fit between the housing and the mount maintains thermal conductivity between the housing and the mount.

5. The method of claim 1 , wherein the mount operates as a heat sink for electronics coupled thereto.

6. The method of claim 1 , further comprising positioning a stator within the housing.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2012
From: NIDEC MOTOR CORPORATION
To: NIDEC SR DRIVES LTD.
Reel/Frame 027820/0727 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2011
From: EMERSON ELECTRIC CO.
To: NIDEC MOTOR CORPORATION
Reel/Frame 025651/0747 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2007
From: STEWART, WILLIAM P.; WILLIAMS, DONALD J.
To: EMERSON ELECTRIC CO.
Reel/Frame 019312/0915 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2005
From: TAKABATAKE, YOSHIHIRO
To: KYOWA SANGYO CO., LTD.; SHINWA SEIKO CO., LTD.
Reel/Frame 016743/0689 →