IP Library › Granted Patent US 7,684,104
Granted Patent B2
US 7,684,104 · App. 11/208,809 · Granted Mar 23, 2010

MEMS using filler material and method

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,684,104
App. No.
11/208,809
Filed
Aug 22, 2005
Granted
Mar 23, 2010
Kind
B2
Examiner
TRA, TUYEN Q
Art Unit
2873
USPC
359/290
Abstract

Described is an apparatus, method for manufacturing, and systems comprising a MEMS device, for example, an interferometric modulator, comprising a substrate, a movable mirror, a deformable layer, and a support structure. In some embodiments, the support structure comprises a plurality of support posts. A connector secures the movable mirror secured to the deformable layer. At least one of the connector and the support post is a composite comprising a first component and a second component, where at the first component forms at least a portion of at least one of the perimeter of the connector and support post.

Claims (40)

1. A microelectromechanical systems device comprising:

a substrate;

a deformable layer;

a support structure supporting the deformable layer;

a movable conductor positioned vertically between the substrate and the deformable layer, wherein at least a portion of the movable conductor is electrically conductive; and

a connector securing the movable conductor to the deformable layer vertically below the deformable layer;

wherein

at least one of the connector and the support structure comprises a first component and a second component,

at least a portion of the first component is disposed on a perimeter of at least one of the connector and the support structure such that at least a portion of the first component is horizontally adjacent to and forms sides of at least a lower portion of the second component;

the second component forms a core of the at least one of the connector and the support structure; and

the first component comprises a non-electrically conductive filler material, wherein the filler material is a spin-on material.

2. The microelectromechanical systems device of claim 1 , wherein the support structure comprises a plurality of support posts, wherein the support posts are supported by the substrate and support the deformable layer.

3. The microelectromechanical systems device of claim 1 , wherein the filler material comprises a self-planarizing material.

4. The microelectromechanical systems device of claim 1 , wherein the filler material comprises a material selected from the group consisting of a dielectric material, a metal, and silicon.

5. The microelectromechanical systems device of claim 1 , wherein the connector and deformable layer are integrated.

6. The microelectromechanical systems device of claim 1 , wherein

the connector comprises a first component and a second component, and

the first component is annular, forming the sides of at least a portion of the connector.

7. The microelectromechanical systems device of claim 6 , wherein the first component forms the sides of the entire connector.

8. The microelectromechanical systems device of claim 7 , wherein the second component comprises a sacrificial material.

9. The microelectromechanical systems device of claim 8 , wherein the sacrificial material comprises molybdenum, silicon, or a combination thereof.

10. The microelectromechanical systems device of claim 1 , wherein at least one support post comprises a support post plug substantially formed from filler material.

11. The microelectromechanical systems device of claim 1 , wherein the microelectromechanical systems device is an optical modulator.

12. The microelectromechanical systems device of claim 1 , wherein:

the connector comprises a first component, and

the first component contacts the movable conductor and forms the sides of the lower portion of the connector.

13. The microelectromechanical systems device of claim 12 , wherein the second component comprises a conductor.

14. The microelectromechanical systems device of claim 1 , further comprising:

a display;

a processor that is in electrical communication with said display, said processor being configured to process image data;

a memory device in electrical communication with said processor.

15. The microelectromechanical systems device of claim 14 , further comprising:

a driver circuit configured to send at least one signal to said display.

16. The microelectromechanical systems device of claim 15 , further comprising:

a controller configured to send at least a portion of said image data to said driver circuit.

17. The microelectromechanical systems device of claim 14 , further comprising:

an image source module configured to send said image data to said processor.

18. The microelectromechanical systems device of claim 17 , wherein said image source module comprises at least one of a receiver, transceiver, and transmitter.

19. The microelectromechanical systems device of claim 14 , further comprising:

an input device configured to receive input data and to communicate said input data to said processor.