Semiconductor device, method of manufacturing semiconductor substrate, and method of manufacturing semiconductor device
View Patent ↗A semiconductor device includes a semiconductor substrate that has an oxide film selectively formed on a part thereof; a semiconductor layer that is formed on the oxide film by epitaxial growth; a first gate electrode that is formed on the semiconductor layer; first source/drain layers that are formed on the semiconductor layer so as to be disposed at both sides of the first gate electrode, respectively; a second gate electrode that is formed on the semiconductor substrate; and second source/drain layers that are formed on the semiconductor substrate so as to be disposed at both sides of the second gate electrode, respectively.
1. A method of manufacturing a semiconductor substrate, comprising:
selectively forming a first semiconductor layer on a part of a surface of a base substrate;
forming a second semiconductor layer on the first semiconductor layer, the second semiconductor layer having a selectivity smaller than that of the first semiconductor layer at the time of etching;
forming an insulating film to cover the second semiconductor layer;
forming an opening in the insulating film, the opening exposing a part of an edge of the first semiconductor layer;
selectively etching the first semiconductor layer through the opening to form a cavity below the second semiconductor layer by removing the first semiconductor layer; and
forming a buried oxide film in the cavity by performing a thermal oxidation treatment on the second semiconductor layer and the base substrate through the opening.
2. The method according to claim 1 , further comprising:
forming an element separation film before the forming of the first semiconductor layer,
the forming of the first semiconductor layer being carried out such that the first semiconductor layer is separated by the element separation film.
3. The method according to claim 1 ,
the forming of the opening being carried out after the forming of the insulating film.
4. A method of manufacturing a semiconductor device, comprising:
forming a first semiconductor layer;
forming a second semiconductor layer on the first semiconductor layer;
forming an insulating film to cover the second semiconductor layer;
forming an opening in the insulating film such that a part of the first semiconductor layer is exposed, the forming of the opening including removing a part of the insulating film;
removing a part of the first semiconductor layer to form a cavity below the second semiconductor layer;
forming a buried oxide film in the cavity;
forming a gate electrode on the second semiconductor layer with the gate insulating film interposed therebetween; and
forming a source or a drain on the second semiconductor layer so as to be disposed at both sides of the gate electrode, respectively.
5. The method according to claim 4 , further comprising:
forming an element separation film before the forming of the first semiconductor layer,
the forming of the first semiconductor layer being carried out such that the first semiconductor layer is separated by the element separation film.
6. The method according to claim 4 ,
the forming of the opening is carried out after the forming of the insulating film.
7. A method of manufacturing a semiconductor substrate, comprising:
forming a first semiconductor layer;
forming a second semiconductor layer on the first semiconductor layer;
forming an insulating film to cover the second semiconductor layer;
forming an opening in the insulating film such that a part of the first semiconductor layer is exposed, the forming of the opening including removing a part of the insulating film;
forming a cavity below the second semiconductor layer, the forming of the cavity including removing a part of the first semiconductor layer; and
forming a buried oxide film in the cavity.
8. The method according to claim 7 ,
the forming of the buried oxide film including a thermal oxidation treatment of the second semiconductor layer and the semiconductor substrate through the opening.
9. The method according to claim 7 ,
the removing of the part of the first semiconductor layer being carried out by an etching process.
10. The method according to claim 9 ,
the first semiconductor layer being etched more easily during a period in which the etching process is carried out than the second semiconductor layer.