Stacked tip cantilever electrical connector
View Patent ↗A probe for a probe card assembly is provided. The probe includes a beam element having a tip end portion. The probe also includes a tip structure on the tip end portion of the beam element. The tip structure includes a plurality of conductive bumps arranged in a stacked configuration.
1. A probe for a probe card assembly comprising:
a beam element having a first end and a second end;
a tip structure on the second end of the beam element, the tip structure including a plurality of flattened conductive bumps arranged in a stacked configuration;
a post structure securing the first end of the beam element to a substrate, wherein the post structure secures the first end of the beam element and allows a remaining portion of the beam element from the first end to the second end of the beam element to deflect in response to the tip structure making contact with a device to be tested; and
adhesive material comprising a layer of gold disposed between at least two adjacent flattened conductive bumps from the plurality of flattened conductive bumps, wherein the layer of gold is in contact with each of the at least two adjacent flattened conductive bumps.
2. The probe according to claim 1 , wherein the plurality of flattened conductive bumps includes a top bump positioned on the at least two flattened conductive bumps.
3. The probe according to claim 2 , wherein the top bump has a shape defined substantially by an interior surface of a bonding tool that defines an aperture of the bonding tool.
4. The probe according to claim 2 , wherein the top bump has a shape selected from the group consisting of substantially pyramidal, substantially conical, or substantially hemispherical.
5. The probe according to claim 1 , wherein at least two flattened conductive bumps from the plurality of flattened conductive bumps have different diameters such that the tip structure defines a tapered shape.
6. The probe according to claim 1 , wherein at least two flattened conductive bumps from the plurality of flattened conductive bumps have substantially similar diameters.
7. A probe card assembly comprising:
a substrate defining a surface; and
a plurality of probe elements supported on the surface of the substrate, each of the probe elements including:
a beam element having a first end and a second end,
a tip structure on the second end of the beam element, the tip structure including a plurality of flattened conductive bumps arranged in a stacked configuration,
a post structure securing the first end of the beam element to the substrate, wherein the post structure secures the first end of the beam element and allows a remaining portion of the beam element from the first end to the second end of the beam element to deflect in response to the tip structure making contact with a device to be tested; and
adhesive material comprising a layer of gold disposed between at least two adjacent flattened conductive bumps from the plurality of flattened conductive bumps, wherein the layer of gold is in contact with each of the at least two adjacent flattened conductive bumps.
8. The probe card assembly according to claim 7 , wherein the plurality of flattened conductive bumps includes a top bump positioned on the at least two flattened conductive bumps.
9. The probe card assembly according to claim 8 , wherein the top bump has a shape defined substantially by an interior surface of a bonding tool that defines an aperture of the bonding tool.
10. The probe card assembly according to claim 8 , wherein the top bump has a shape selected from the group consisting of substantially pyramidal, substantially conical, or substantially hemispherical.
11. The probe card assembly according to claim 7 , wherein at least two flattened conductive bumps from the plurality of flattened conductive bumps have different diameters such that the tip structure defines a tapered shape.
12. The probe card assembly according to claim 7 , wherein at least two flattened conductive bumps from the plurality of flattened conductive bumps have substantially similar diameters.