Printhead

1 . A method of forming a printhead comprising:

providing a support,

firing a material to provide a fired piezoelectric body,

fixing said piezoelectric body to said support,

after fixing to said body to the support, reducing the thickness of said fixed piezoelectric layer to about 50 microns or less to provide a piezoelectric layer, and

utilizing said layer in a piezoelectric actuator.

2 . The method of claim 1 further comprising reducing the thickness by grinding.

3 . The method of claim 1 wherein the support is silicon.

4 . The method of claim 1 wherein providing a support includes providing a support with a fluid flow path.

5 . The method of claim 4 wherein the fluid flow path includes a pumping chamber.

6 . The method of claim 5 wherein the pumping chamber includes a well on one face of the support and the piezoelectric actuator overlies the pumping chamber.

7 . The method of claim 6 wherein the flow path includes a conduit to the second opposing side of the support to direct fluid to a nozzle.

8 . The method of claim 5 wherein providing said support includes providing a support having an actuator membrane over a flow path.

9 . The method of claim 8 wherein the actuator membrane is glass or silicon.

10 . The method of claim 8 further comprising reducing the thickness of the actuator membrane to about 50 microns or less.

11 . The method of claim 10 further comprising reducing the thickness of the actuator membrane to about 25 microns or less.

12 . The method of claim 8 wherein fixing the actuator membrane to the support includes fixing the actuator substrate to the support by anodic bonding.

13 . The method of claim 1 including fixing the piezoelectric body with an organic material.

14 . The method of claim 1 wherein the piezoelectric layer has a d 31 of about 200 or more.

15 . The method of claim 1 wherein the piezoelectric layer has a density of 7.5 g/cm or more.

16 . The method of claim 1 wherein the piezoelectric layer surface has an Ra of about 0.05 micron or less.

17 . The method of claim 1 wherein reducing the thickness of said body includes reducing the thickness to about 25 microns or less.

18 . A method of forming a printhead comprising:

etching a flow path into a semiconductor layer;

fixing a piezoelectric material to the semiconductor layer;

thinning the piezoelectric material to less than about 50 microns to form a piezoelectric layer; and

forming an electrode layer on the thinned piezoelectric layer.

19 . The method of claim 18 further comprising fixing a membrane layer onto the semiconductor layer so that a portion of the flow path is covered.

20 . The method of claim 18 wherein thinning the piezoelectric material includes grinding.

21 . The method of claim 18 wherein fixing the piezoelectric material includes fixing the piezoelectric material with an organic material.

22 . A method of forming a print head comprising:

providing a piezoelectric body,

reducing the thickness of the piezoelectric body to about 50 microns or less by grinding to form a piezoelectric layer,

incorporating said piezoelectric layer into a piezoelectric actuator, and

utilizing the piezoelectric actuator to eject fluid from said print head.

23 . The method of claim 22 comprising reducing the thickness of said body to about 25 microns or less.

24 . The method of claim 22 comprising reducing the thickness of said body to about 8 to 18 microns.