Printed wiring boards possessing regions with different coefficients of thermal expansion
View Patent ↗Printed wiring boards are disclosed that include regions having different coefficients of thermal expansion. In one aspect of the invention, the regions can be matched to the coefficients of thermal expansion of devices mounted on the printed wiring board. In one embodiment, the invention includes a layer including a base material and at least one insert material that are combined using a resin. In addition, the base material and insert material are located within the same plane.
1. A printed wiring board comprising:
a layer including a base material and at least one planar insert material that are combined using a resin;
wherein the base material and planar insert material are located within the same plane;
wherein the base material comprises the majority of the layer;
wherein the composition of at least one of the planar insert materials is different to the composition of the base material and the resin; and
wherein at least one of the insert materials includes fibers.
2. The printed wiring board of claim 1 , wherein the layer formed by the base material and the at least one planar insert materials is clad on at least one side with a layer of electrically conductive material.
3. The printed wiring board of claim 1 , wherein the base material is a dielectric material.
4. The printed wiring board of claim 3 , wherein at least one of the planar insert materials is dielectric.
5. The printed wiring board of claim 3 , wherein at least one of the planar insert materials is non-dielectric.
6. The printed wiring board of claim 5 , wherein at least one plated through hole passes through the non-dielectric planar insert material.
7. The printed wiring board of claim 6 , further comprising:
a layer of electrically conductive material separated from the layer formed by the base material, at least one planar insert materials and resin by at least a dielectric layer;
wherein at least one of the plated through holes establishes an electrical connection between the non-dielectric planar insert material and the layer of electrically conductive material.
8. The printed wiring board of claim 6 , wherein at least one of the plated through holes passes through a dielectric filled clearance hole in the non-dielectric planar insert material.
9. The printed wiring board of claim 1 , wherein the base material is non-dielectric.
10. The printed wiring board of claim 9 , further comprising:
a layer of electrically conductive material separated from the layer formed by the base material, at least one planar insert materials and resin by at least a dielectric layer; and
at least one plated through hole; wherein a plated through hole establishes an electrical connection between the non-dielectric base material and the layer of electrically conductive material.
11. The printed wiring board of claim 9 , wherein at least one of the planar insert materials is dielectric.
12. The printed wiring board of claim 9 , wherein at least one of the planar insert materials is non-dielectric.
13. The printed wiring board of claim 12 , further comprising at least one plated through hole that passes through the non-dielectric planar insert material.
14. The printed wiring board of claim 13 , further comprising:
a layer of electrically conductive material separated from the layer formed by the base material, at least one planar insert materials and resin by at least a dielectric layer;
wherein at least one of the plated through holes establishes an electrical connection between the non-dielectric planar insert material and the layer of electrically conductive material.
15. The printed wiring board of claim 13 , wherein at least one of the plated through holes passes through a dielectric filled clearance hole in the non-dielectric planar insert material.
16. The printed wiring board of claim 1 , wherein the fibers are E-glass fibers.
17. The printed wiring board of claim 1 , wherein the fibers are carbon fibers.
18. The printed wiring board of claim 1 , wherein the fibers are Aramid fibers.
19. The printed wiring board of claim 1 , wherein the fibers are woven fibers.
20. The printed wiring board of claim 1 , wherein the fibers are non-woven fibers.