IP Library Granted Patent US 7,858,982
Granted Patent B2
US 7,858,982 · App. 11/215,067 · Granted Dec 28, 2010

Thin film transistor array panel and method for manufacturing the same

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Quick Facts
Patent No.
US 7,858,982
App. No.
11/215,067
Granted
Dec 28, 2010
Kind
B2
Abstract

The present invention provides a thin film transistor array panel comprising: an insulating substrate; a gate line formed on the insulating substrate and having a gate electrode; a gate insulating layer formed on the gate line; a semiconductor formed on the gate insulating layer and overlapping the gate electrode; diffusion barriers formed on the semiconductor and containing nitrogen; a data line crossing the gate line and having a source electrode partially contacting the diffusion barriers; a drain electrode partially contacting the diffusion barriers and facing the source electrode on the gate electrode; and a pixel electrode electrically connected to the drain electrode.

Claims (19)

1. A thin film transistor array panel comprising:

an insulating substrate;

a gate line formed on the insulating substrate and comprising a gate electrode;

a gate insulating layer formed on the gate line;

a semiconductor layer formed on the gate insulating layer and overlapping the gate electrode;

diffusion barriers formed on the semiconductor layer;

ohmic contact layers disposed between the semiconductor layer and the diffusion barriers;

a data line crossing the gate line and comprising a source electrode partially contacting the diffusion barriers;

a drain electrode partially contacting the diffusion barriers and facing the source electrode; and

a pixel electrode electrically connected to the drain electrode,

wherein the diffusion barriers comprise silicide including nitrogen, or silicon doped with an n-type impurity and including nitrogen.

2. The thin film transistor array panel of claim 1 , wherein the diffusion barriers have a substantially same planar pattern as the ohmic contact layers.

3. The thin film transistor array panel of claim 1 , wherein the ohmic contact layers comprise the same material as the diffusion barriers except nitrogen.

4. The thin film transistor array panel of claim 1 , wherein the data line comprises first to third conductor layers, the first and third conductor layers comprising Mo or a Mo alloy, and the second conductor layer comprising Al or an Al alloy.

5. The thin film transistor array panel of claim 1 , further comprising color filters formed between the pixel electrode and the data line, and the drain electrode.

6. The thin film transistor array panel of claim 5 , further comprising a passivation layer formed between the pixel electrode and the color filters.

7. The thin film transistor array panel of claim 6 , further comprising an interlayer insulating layer formed between the color filters and the data line, drain electrode, and semiconductor layer.

8. The thin film transistor array panel of claim 1 , wherein the pixel electrode has a plurality of cutouts partitioning a pixel area into a plurality of domains.

9. The thin film transistor array panel of claim 1 , wherein the diffusion barriers have a thickness between 10 Å and 100 Å.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028999/0611 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2005
From: LEE, JE-HUN; CHO, BEOM-SEOK; JEONG, CHANG-OH; KIM, JOO-HAN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 016984/0322 →